CS9202 datasheet(2/6 Pages) ONSEMI

2 / 6 page

CS9202

http://onsemi.com

MAXIMUM RATINGS*

Parameter

Value

Unit

Power Dissipation

Internally Limited

−

Input Voltage (VIN):

Peak Transient Voltage (60 V Load Dump @ VIN = 14 V)

−15 to 36

Output Current

Internally Limited

−

ESD Susceptibility (Human Body Model)

4.0

Package Thermal Resistance:

Junction−to−Case, RθJC

Junction−to−Ambient, RθJA

110

°C/W

Junction Temperature

−40 to +150

°C

Storage Temperature

−55 to +150

°C

Lead Temperature Soldering:

Reflow (SMD styles only) Note 1

230 Peak

°C

1. 60 second maximum above 183

°C.

*The maximum package power dissipation must be observed.

ELECTRICAL CHARACTERISTICS (4.5 V

≤ VIN ≤ 26 V, IOUT = 1.0 mA, −40°C ≤ TJ ≤ 125°C; unless otherwise stated.)

Parameter

Test Conditions

Min

Typ

Max

Unit

Output Stage

Output Voltage, VOUT

9.0 V < VIN < 16 V, 100 mA ≤ IOUT ≤ 100 mA

4.5 V < VIN < 26 V, 100 mA ≤ IOUT ≤ 100 mA

3.234

3.201

3.300

3.366

3.399

Load Regulation

VIN = 14 V, 100 mA ≤ IOUT ≤ 100 mA

−

Line Regulation

4.5 V < V < 26 V, IOUT = 1.0 mA

−

Quiescent Current, (IQ)

IOUT = 100 mA, VIN = 12 V

IOUT ≤ 50 mA

IOUT ≤ 100 mA

−

450

750

Ripple Rejection

7.0 V

≤ VIN ≤ 17 V, IOUT = 100 mA, f = 120 Hz

−

Current Limit

−

105

200

−

Short Circuit Output Current

VOUT = 0 V

125

−

Thermal Shutdown (Note 2)

−

150

180

−

°C

Overvoltage Shutdown

VOUT ≤ 1.0 V

2. This parameter is guaranteed by design, but not parametrically tested in production.

PACKAGE LEAD DESCRIPTION

Package Lead Number

SO−8

Lead Symbol

Function

VOUT

3.3 V,

± 2%, 100 mA output.

2, 3, 6, 7

GND

Ground.

4, 5

No connection.

VIN

Input voltage.

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