LT3027 datasheet(11/16 Pages) LINER

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LT3027

3027f

For continuous normal conditions, the maximum junction

temperature rating of 125°C must not be exceeded. It is

important to give careful consideration to all sources of

thermal resistance from junction to ambient. Additional

heat sources mounted nearby must also be considered.

For surface mount devices, heat sinking is accomplished

by using the heat spreading capabilities of the PC board

and its copper traces. Copper board stiffeners and plated

through-holes can also be used to spread the heat gener-

ated by power devices.

The following tables list thermal resistance for several

different board sizes and copper areas. All measurements

were taken in still air on 3/32" FR-4 board with one ounce

copper.

Table 1. MSE Package, 10-Lead MSOP

COPPER AREA

THERMAL RESISTANCE

TOPSIDE*

BACKSIDE

BOARD AREA

(JUNCTION-TO-AMBIENT)

2500mm

40°C/W

1000mm

2500mm

45°C/W

225mm

2500mm

50°C/W

100mm

2500mm

62°C/W

*Device is mounted on topside.

Table 2. DD Package, 10-Lead DFN

COPPER AREA

THERMAL RESISTANCE

TOPSIDE*

BACKSIDE

BOARD AREA

(JUNCTION-TO-AMBIENT)

2500mm

40°C/W

1000mm

2500mm

45°C/W

225mm

2500mm

50°C/W

100mm

2500mm

62°C/W

*Device is mounted on topside.

The thermal resistance juncton-to-case (θJC), measured

at the Exposed Pad on the back of the die is 10°C/W.

Calculating Junction Temperature

Example: Given an output voltage on the first channel of

3.3V, an output voltage of 2.5V on the second channel, an

input voltage range of 4V to 6V, output current ranges of

0mA to 100mA for the first channel and 0mA to 50mA for

the second channel, with a maximum ambient tempera-

ture of 50°C, what will the maximum junction temperature

be?

Voltage and temperature coefficients are not the only

sources of problems. Some ceramic capacitors have a

piezoelectric response. A piezoelectric device generates

voltage across its terminals due to mechanical stress,

similar to the way a piezoelectric accelerometer or

microphone works. For a ceramic capacitor the stress

can be induced by vibrations in the system or thermal

transients. The resulting voltages produced can cause

appreciable amounts of noise, especially when a ceramic

capacitor is used for noise bypassing. A ceramic capaci-

tor produced Figure 5’s trace in response to light tapping

from a pencil. Similar vibration induced behavior can

masquerade as increased output voltage noise.

APPLICATIO S I FOR ATIO

Thermal Considerations

The power handling capability of the device will be limited

by the maximum rated junction temperature (125°C). The

power dissipated by the device will be made up of two

components (for each channel):

1. Output current multiplied by the input/output voltage

differential: (IOUT)(VIN – VOUT), and

2. GND pin current multiplied by the input voltage:

(IGND)(VIN).

The ground pin current can be found by examining the

GND Pin Current curves in the Typical Performance

Characteristics section. Power dissipation will be equal to

the sum of the two components listed above. Power

dissipation from both channels must be considered dur-

ing thermal analysis.

The LT3027 regulator has internal thermal limiting de-

signed to protect the device during overload conditions.

100ms/DIV

3027 F05

VOUT

500µV/DIV

Figure 5. Noise Resulting from Tapping on a Ceramic Capacitor

COUT = 10µF

CBYP = 0.01µF

ILOAD = 100mA

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