Smallest 1A, 1.4MHz Step-Down Regulators

2

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ABSOLUTE MAXIMUM RATINGS

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

IN, POK, CTL1, CTL2, FBSEL, ON to GND ..............-0.3V to +6V

PGND to GND .......................................................-0.3V to +0.3V

LX Current (Note 1) ...............................................-2.4A to +2.4A

10-Pin µMAX (derate 5.6mW/°C above +70°C) .......... 444mW

Operating Temperature Range ...........................-40°C to +85°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

ELECTRICAL CHARACTERISTICS

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

IN

IN Voltage Range

2.6

5.5

V

IN Undervoltage Lockout

Threshold

Rising and falling, hysteresis is 25mV (typ)

2.2

2.35

2.5

V

Supply Current

Switching with no load

4.0

7.5

mA

Supply Current in Dropout

3

5

mA

Shutdown Supply Current

0.1

10

µA

FB

MAX1973

1.25

Output Voltage Range

MAX1974

0.75

V

FBSEL not connected

1.2375

1.25

1.2625

FBSEL = GND

1.7820

1.8

1.8180

MAX1973

FBSEL = IN

2.4750

2.5

2.5250

FBSEL not connected

0.7425

0.75

0.7575

FBSEL = GND

0.99

1.00

1.01

FB Regulation Voltage

MAX1974

FBSEL = IN

1.485

1.500

1.515

V

FB Regulation Voltage

Positive Voltage Margining

MAX1973, CTL1 = GND, CTL2 = IN

+3

+4

+5

%

FB Regulation Voltage

Negative Voltage Margining

MAX1973, CTL1 = IN, CTL2 = GND

-3

-4

-5

%

FB Input Resistance to GND in

Preset Output Modes

10

30

70

k

Ω

FB Input Bias Current

FBSEL not connected

-0.1

0.01

+0.1

µA

SS (REFERENCE OUTPUT)

MAX1974

0.75

SS Voltage

MAX1973

1.25

V

Note 1: LX has internal clamp diodes to IN and PGND. Applications that forward bias these diodes should take care not to exceed

the IC package power dissipation limit.