eGaN® FET DATASHEET

EPC – THE LEADER IN GaN TECHNOLOGY | WWW.EPC-CO.COM | COPYRIGHT 2019 |

| 7

EPC8009

2050

1

2

4

3

6

5

190

600

600

400

440

Recommended stencil should be 4 mil (100 μm) thick, must be laser cut, openings per drawing. Intended for use with SAC305 Type 3 solder, reference 88.5% metals content.

Additional assembly resources available at: https://epc-co.com/epc/DesignSupport/AssemblyBasics.aspx

DIE OUTLINE

Solder Bar View

Side View

Dim

Micrometers

Min

Nominal

Max

A

2020

2050

2080

B

820

850

880

C

555

580

605

d

400

400

400

e

600

600

600

f

200

225

250

g

175

200

225

h

425

450

475

i

175

200

225

j

400

400

400

Pad no. 1 is Gate

Pad no. 2 is Source Return for Gate Driver

Pad no. 3 and 5 are Source

Pad no. 4 is Drain

*Substrate pin should be connected to Source

2050

325

200

245

230

450

275

1

2

4

3

6

5

A

i

1

2

3

4

5

6

g

x2

e

e

d

f

h

Seating Plane

Efficient Power Conversion Corporation (EPC) reserves the right to make changes without further notice to any products herein to improve reliability,

function or design. EPC does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it

convey any license under its patent rights, nor the rights of others. eGaN® is a registered trademark of Efficient Power Conversion Corporation.

EPC Patent Listing: epc-co.com/epc/AboutEPC/Patents.aspx

The land pattern is solder mask defined.

Solder mask opening is 5 µm smaller per side than bump.

Information subject to

change without notice.

Revised August, 2019

Pad no. 1 is Gate

Pad no. 2 is Source Return for Gate Driver

Pad no. 3 and 5 are Source

Pad no. 4 is Drain

Pad no. 6 is Substrate*

*Substrate pin should be connected to Source