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ARM7 Datasheet(PDF) 25 Page - NXP Semiconductors

Part # ARM7
Description  Single-chip 16-bit/32-bit microcontrollers; up to 512 kB flash with ISP/IAP, USB 2.0 full-speed device, 10-bit ADC and DAC
PDF  38 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

ARM7 Datasheet(HTML) 25 Page - NXP Semiconductors

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9397 750 14985
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Preliminary data sheet
Rev. 01 — 3 October 2005
25 of 38
Philips Semiconductors
LPC2141/42/44/46/48
Single-chip 16-bit/32-bit microcontrollers
7.
Limiting values
[1]
The following applies to the Limiting values:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum.
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless
otherwise noted.
[2]
Core and external rail.
[3]
3.3 V pad.
[4]
On ADC related pins.
[5]
Including voltage on outputs in 3-state mode.
[6]
Only valid when the VDD supply voltage is present.
[7]
Not to exceed 4.6 V.
[8]
Per supply pin.
[9]
The peak current is limited to 25 times the corresponding maximum current.
[10] Per ground pin.
[11] Dependent on package type.
Table 4:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). [1]
Symbol
Parameter
Conditions
Min
Max
Unit
VDD
supply voltage [2]
−0.5
+3.6
V
VDDA
analog supply voltage [3]
−0.5
4.6
V
Vi(VBAT)
input voltage on pin VBAT
for the RTC
−0.5
4.6
V
Vi(VREF)
input voltage on pin VREF
−0.5
4.6
V
Via
analog input voltage [4]
−0.5
5.1
V
VI
input voltage
5 V tolerant I/O
pins
[5] [6]
−0.5
6.0
V
other I/O pins
[5]
−0.5
VDD + 0.5 [7] V
IDD
DC supply current [8]
-
100 [9]
mA
ISS
DC ground current [10]
-
100 [9]
mA
Tstg
storage temperature [11]
−40
125
°C
Ptot(pack)
package total power dissipation
based on package
heat transfer, not
device power
consumption
-
1.5
W



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