SM8S datasheet(4/6 Pages) LEIDITECH

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0.01

0.1

1.0

100

0.01

0.1

FIG.5: Typical Transient Thermal Impedance

t-Pulse Width (

SOLDERING PARAMETERS

Reflow Condition

Pre

Heat

-Temperature Min (Ts(min)

-Temperature Max(Ts(max)

-Time (Min to Max) (ts)

Average ramp up rate (Liquid us Temp

(TL) to peak)

Ts(max) to TL - Ramp-up Rate

Reflow

-Temperature(TL)(Liquid us)

-Temperature(tL)

Peak Temp (Tp)

Time within 5℃ of actual Peak Temp (t

Ramp-down Rate

Time 25℃ to Peak Temp (TP)

Do not exceed

100

RθJA

RθJC

Typical Transient Thermal Impedance

(s)

1000

10000

100000

Measured at Stand-Off

Voltage VWM

VWM-Reverse Stand-Off Voltage

FIG.6: Typical Junction Capacitance

Pb-Free assembly

(see FIG.5)

s(min))

+150℃

s(max))

+200℃

60-180 secs.

Average ramp up rate (Liquid us Temp

3℃/sec. Max

)(Liquid us)

+217℃

60-150 secs.

+260(+0/-5)℃

of actual Peak Temp (tp)

30 secs. Max

6℃/sec. Max

8 min. Max

+260℃

FIG.6: Reflow condition

TS(min)

TS(max)

time to peak temperatue

(t 25

to peak)

℃

Preheat

Measured at Zero Bias

Measured at Stand-Off

Tj=25℃

f=1.0MHz

Vsig=50mVp-p

Reverse Stand-Off Voltage (V)

Typical Junction Capacitance

Reflow condition

time to peak temperatue

Time

(t 25

to peak)

℃

Ramp-up

Ramp-down

Preheat

Critical Zone

TL to TP

Rev :

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SM8S Series 6600W Transient Voltage Suppressor

00W Transient Voltage Suppressor

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