6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1) (2) (3)

MIN

MAX

UNIT

Supply voltage

–0.3

6

V

Logic control input pin voltage (EN, A0, A1, A2)

–0.3

6

V

Logic control input pin current (EN, A0, A1, A2)

–30

30

mA

Source or drain voltage (Sx, D)

–0.5

V

Source or drain continuous current (Sx, D)

–30

30

mA

Diode clamp current(4)

–30

30

mA

Storage temperature

–65

150

°C

Junction temperature

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.

(3)

All voltages are with respect to ground, unless otherwise specified.

(4)

Signal path pins are diode-clamped to the power-supply rails. Over voltage signals must be voltage and current limited to maximum

ratings.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic

discharge

Human body model (HBM), per AEC Q100-002(1)

HBM ESD Classification Level 2

±2000

V

Charged device model (CDM), per AEC Q100-011

CDM ESD Classification Level C4B

±750

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

1.08

5.5

V

Signal path input/output voltage (source or drain pin) (Sx, D)

0

V

Logic control input pin voltage (EN, A0, A1, A2)

0

5.5

V

Ambient temperature

–40

125

°C

6.4 Thermal Information

THERMAL METRIC(1)

TMUX1208-Q1

UNIT

RSV (QFN)

16 PINS

Junction-to-ambient thermal resistance

134.6

°C/W

Junction-to-case (top) thermal resistance

74.3

°C/W

Junction-to-board thermal resistance

62.8

°C/W

Junction-to-top characterization parameter

4.3

°C/W

Junction-to-board characterization parameter

61.1

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

TMUX1208-Q1

SCDS415A – AUGUST 2019 – REVISED JULY 2020

www.ti.com

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