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TMUX1208 Datasheet(PDF) 21 Page - Texas Instruments

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Part # TMUX1208
Description  TMUX1208-Q1 5-V Bidirectional 8:1 Multiplexer with 1.8-V Logic
PDF  32 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TMUX1208 Datasheet(HTML) 21 Page - Texas Instruments

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9.4 Detailed Design Procedure
The TMUX1208-Q1 can be operated without any external components except for the supply decoupling
capacitors. If the parts desired power-up state is disabled, the enable pin should have a weak pull-down resistor
and be controlled by the MCU via GPIO. All inputs being muxed to the ADC of the MCU must fall within the
recommend operating conditions of the TMUX1208-Q1 including signal range and continuous current. For this
design with a supply of 5 V, the signal range can be 0 V to 5 V and the max continuous current can be 30 mA.
9.5 Application Curve
Source or Drain Voltage (V)
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0
20
40
60
80
VDD= 4.5V
VDD= 3V
VDD= 1.62V
VDD= 1.08V
D001
TA = 25°C
Figure 9-2. On-Resistance vs Source or Drain Voltage
9 Power Supply Recommendations
The TMUX1208-Q1 operate across a wide supply range of 1.08 V to 5.5 V. Do not exceed the absolute
maximum ratings because stresses beyond the listed ratings can cause permanent damage to the devices.
Power-supply bypassing improves noise margin and prevents switching noise propagation from the VDD supply
to other components. Good power-supply decoupling is important to achieve optimum performance. For
improved supply noise immunity, use a supply decoupling capacitor ranging from 0.1 μF to 10 μF from VDD to
ground. Place the bypass capacitors as close to the power supply pins of the device as possible using low-
impedance connections. TI recommends using multi-layer ceramic chip capacitors (MLCCs) that offer low
equivalent series resistance (ESR) and inductance (ESL) characteristics for power-supply decoupling purposes.
For very sensitive systems, or for systems in harsh noise environments, avoiding the use of vias for connecting
the capacitors to the device pins may offer superior noise immunity. The use of multiple vias in parallel lowers
the overall inductance and is beneficial for connections to ground planes.
www.ti.com
TMUX1208-Q1
SCDS415A – AUGUST 2019 – REVISED JULY 2020
Copyright © 2020 Texas Instruments Incorporated
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