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3521 Datasheet(PDF) 5 Page - TE Connectivity Ltd

Part # 3521
Description  SMD POWER RESISTORS AEC-Q200 QUALIFIED
PDF  7 Pages
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Manufacturer  TEC [TE Connectivity Ltd]
Direct Link  http://www.te.com/usa-en/home.html
Logo TEC - TE Connectivity Ltd

3521 Datasheet(HTML) 5 Page - TE Connectivity Ltd

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SMD POWER RESISTORS AEC-Q200 QUALIFIED
9-1773463-5 Rev G 02/2020
Dimensions in
millimetres unless
otherwise specified
Dimensions Shown for
reference purposes only.
Specifications subject to
change
For Email, phone or live chat,
go to: www.te.com/help
Performance Specification (continued)
Characteristics
Limits
Test Methods
Thermal Shock
±(1%+0.1
Ω max
-55°C/+155°C
Note: Number of cycles required -300,
Maximum transfer time -20 seconds, Dwell
time -15 minutes. Air-Air.
(MIL-STD-202 Method 107)
<50m
Ω
Apply to rate current for 0
Ω
ESD
±(10%+0.1W)max
With the electrometer in direct contact with
the discharge tip, verify the voltage setting
at levels of
±500V,±1KV, ±2KV, ±4KV, ±8KV,
The electrometer reading shall be within
±10% for voltages from 500V to
≦800V.
(AEC-Q200-002)
Solderability
95% coverage Min.
For both leaded & SMD. Electrical test not
required
Magnification 50X. Conditions:
a) Method B 4hrs at 155°C dry heat, the dip
in bath with 245°C,5s.
b) Method B: at 215°C,5s.
c) Method D: at 260°C, 60s.
( J-STD-002)
Flammability
No ignition of the tissue paper or
scorching of the pinewood board
V-0 or V-1 are acceptable. Electrical test not
required.
(UL-94)
Board Flex
±(1%+0.05W)max
2mm (Min) (JIS-C-6429)
<50mW
Apply to rate current for 0 W
Flame Retardance
No flame
Temperature sensing at 500
฀, Voltage
power subjected to 32VDC current clamped
up to 500ADC and decreased in
1.0VDC/hour.
( AEC-Q200-001)
Resistance to
soldering Heat
± %+ . Ω a.
Condition B No per-heat of samples. Note:
Single Wave Solder-Procedure 2 for SMD
and Procedure 1 for Leaded with solder
within 1.5mm of device body.
(MIL-STD-202 Method 210)
<50mW
Apply to rate current for 0 W
* Sulfuration test: H2S 3~5PPM 50°C
±
2°C 91%~93%RH 1000H
Packaging specification
Embossed Taping:
A
±0.2
B
±0.2
C
±0.05
ØD+0.1
-0
ØD1+0.1
-0
E
±0.1
F
±0.05
G
±0.1
W
±0.2
T ±
0.1
3.50
6.70
2.0
1.5
1.5
1.75
5.5
4.0
12.0
1.0



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