SE050 datasheet(4/30 Pages) NXP

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NXP Semiconductors

SE050

Plug & Trust Secure Element

SE050

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Product data sheet

Rev. 3.0 — 12 May 2020

504930

4 / 30

2.3 Features in detail

Table 2. Feature Overview

Categories

Subcategory

Value

Security certification

CC EAL6+ (HW+JCOP)

JavaCard version

3.0.5

Standards

GlobalPlatform specification version

GP 2.3.1

ECC

ECDSA, ECDH, ECDHE, ECDAA,

EdDSA

MAC

HMAC, secure HMAC, CMAC

Hash

SHA-1, SHA-224, SHA-256, SHA-384,

SHA-512

Key derivation

HKDF, PBKDF2, PRF (TLS-PSK),

CMAC (MIFARE-AES-KDF)

AES

AES (128, 192, 256)

3DES

2K, 3K

Cryptography

RSA

RSA cipher for de-/encryption (up to

4096 bit)

ECC NIST (192 to 521 bit)

Brainpool (160 to 512 bit)

Twisted Edwards Ed25519 /

Montgomery Curve25519

Koblitz (192 to 256 bit)

Crypto curves

ECC

Barreto-Naehrig Curve 256 bit

User memory

50 kB

Memory reliability

up to 100 Mio write cycles / 25 years

Interfaces

I2C Slave

High-speed mode (3.4 Mbps)

I2C Master

Fast Mode (400 kbit/s)

Contactless

ISO14443-A PICC

Power saving modes

Power-Down (with state retention)

< 500µA

Deep Power-Down (no state retention) <5 µA

Standard

-25 - 85 °C, see Naming Conventions

Temperature

Extended

-40 - +105 °C, see Naming Conventions

Packaging

Plastic QFN

3x3 mm (HX2QFN20)

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