DLP471TP datasheet(2/48 Pages) TI

2 / 48 page

Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 1

3 Description.......................................................................1

4 Revision History.............................................................. 2

5 Pin Configuration and Functions...................................3

6 Specifications.................................................................. 8

6.1 Absolute Maximum Ratings........................................ 8

6.2 Storage Conditions..................................................... 9

6.3 ESD Ratings............................................................... 9

6.4 Recommended Operating Conditions.........................9

6.5 Thermal Information.................................................. 11

6.6 Electrical Characteristics...........................................11

6.7 Switching Characteristics..........................................13

6.8 Timing Requirements................................................14

6.9 System Mounting Interface Loads............................ 17

6.10 Micromirror Array Physical Characteristics............. 19

6.11 Micromirror Array Optical Characteristics............... 20

6.12 Window Characteristics.......................................... 22

6.13 Chipset Component Usage Specification............... 22

7 Detailed Description......................................................23

7.1 Overview................................................................... 23

7.2 Functional Block Diagram......................................... 23

7.3 Feature Description...................................................24

7.4 Device Functional Modes..........................................24

7.5 Optical Interface and System Image Quality

Considerations............................................................ 24

7.6 Micromirror Array Temperature Calculation.............. 25

7.7 Micromirror Landed-On/Landed-Off Duty Cycle....... 27

8 Application and Implementation.................................. 30

8.1 Application Information............................................. 30

8.2 Typical Application.................................................... 30

8.3 Temperature Sensor Diode....................................... 31

9 Power Supply Recommendations................................32

9.1 DMD Power Supply Power-Up Procedure................ 32

9.2 DMD Power Supply Power-Down Procedure........... 32

10 Layout...........................................................................34

10.1 Layout Guidelines................................................... 34

10.2 Impedance Requirements.......................................34

10.3 Layers..................................................................... 34

10.4 Trace Width, Spacing..............................................35

10.5 Power......................................................................35

10.6 Trace Length Matching Recommendations............ 36

11 Device and Documentation Support..........................37

11.1 Device Support........................................................37

11.2 Documentation Support.......................................... 38

11.3 Support Resources................................................. 38

11.4 Trademarks............................................................. 38

11.5 Electrostatic Discharge Caution.............................. 38

12 Mechanical, Packaging, and Orderable

Information.................................................................... 39

12.1 Package Option Addendum.................................... 40

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

DATE

REVISION

NOTES

August 2020

Initial release.

DLP471TP

DLPS173 – AUGUST 2020

www.ti.com

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