7.4 Thermal Information: TMUX1308

THERMAL METRIC(1)

TMUX1308

UNIT

PW (TSSOP)

DYY (SOT)

BQB (WQFN)

PINS

PINS

PINS

Junction-to-ambient thermal resistance

139.6

167.1

94.8

°C/W

Junction-to-case (top) thermal resistance

77.2

106.3

92.6

°C/W

Junction-to-board thermal resistance

84.2

90.0

64.5

°C/W

Junction-to-top characterization parameter

26.5

17.2

13.3

°C/W

Junction-to-board characterization parameter

83.8

90.0

64.4

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

42.7

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.5 Thermal Information: TMUX1309

THERMAL METRIC(1)

TMUX1309

UNIT

PW (TSSOP)

DYY (SOT)

BQB (WQFN)

PINS

PINS

PINS

Junction-to-ambient thermal resistance

thermal information for TMUX1309

139.6

172.4

94.8

°C/W

Junction-to-case (top) thermal resistance

77.2

107.0

92.6

°C/W

Junction-to-board thermal resistance

84.2

96.1

64.5

°C/W

Junction-to-top characterization parameter

26.5

19.7

13.3

°C/W

Junction-to-board characterization parameter

83.8

95.9

64.4

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

42.7

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

TMUX1308, TMUX1309

SCDS426C – MARCH 2020 – REVISED AUGUST 2020

www.ti.com

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