8

Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,

depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product

status are available at: www.st.com. ECOPACK is an ST trademark.

8.1

LGA-16 package information

The IIS3DHHC is available in a high-performance (low-stress) ceramic cavity land grid array (CC LGA) package.

Due to the use of epoxy glue for lid sealing, hermeticity is not guaranteed. Processing or use of this package in a

harsh environment should be assessed by the customer.

Pin 1

indicator

L

H

8535893_A

Note:

Top and bottom view: dimensions are expressed in mm

ITEM

Dimension [mm]

Tolerance [mm]

Length [L]

5

±0.15

Width [W]

5

±0.15

Height [H]

1.7 typ

±0.15

Pad size

0.7 x 0.5

±0.15

Note:

General tolerance is ±0.1 mm unless otherwise specified

IIS3DHHC

Package information

DS12292 - Rev 3

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