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ADSP-21486KSWZ-2AB Datasheet(PDF) 17 Page - Analog Devices |
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ADSP-21486KSWZ-2AB Datasheet(HTML) 17 Page - Analog Devices |
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17 / 71 page ![]() ADSP-21483/ADSP-21486/ADSP-21487/ADSP-21488/ADSP-21489 Rev. H | Page 17 of 71 | February 2020 CLK_CFG1–0 I Core to CLKIN Ratio Control. These pins set the start up clock frequency. Note that the operating frequency can be changed by programming the PLL multiplier and divider in the PMCTL register at any time after the core comes out of reset. The allowed values are: 00 = 8:1 01 = 32:1 10 = 16:1 11 = reserved CLKIN I Local Clock In. Used in conjunction with XTAL. CLKIN is the clock input. It configures the processors to use either its internal clock generator or an external clock source. Connecting the necessary components to CLKIN and XTAL enables the internal clock generator. Connecting the external clock to CLKIN while leaving XTAL unconnected configures the processors to use the external clock source such as an external clock oscillator. CLKIN may not be halted, changed, or operated below the specified frequency. XTAL O Crystal Oscillator Terminal. Used in conjunction with CLKIN to drive an external crystal. RESET I Processor Reset. Resets the processor to a known state. Upon deassertion, there is a 4096 CLKIN cycle latency for the PLL to lock. After this time, the core begins program execution from the hardware reset vector address. The RESET input must be asserted (low) at power-up. RESETOUT/ RUNRSTIN I/O (ipu) Reset Out/Running Reset In. The default setting on this pin is reset out. This pin also has a second function as RUNRSTIN which is enabled by setting bit 0 of the RUNRSTCTL register. For more information, see the hardware reference manual. BOOT_CFG2–0 I Boot Configuration Select. These pins select the boot mode for the processor (see Table 9). The BOOT_CFG pins must be valid before RESET (hardware and software) is asserted. 1 The MLB pins are only available on the automotive models. Table 12. Pin List, Power, Ground and Other Name Type Description VDD_INT P Internal Power Supply VDD_EXT P I/O Power Supply GND1 G Ground VDD_THD P Thermal Diode Power Supply. When not used, this pin can be left floating. DNC DNC Do Not Connect. Do not make any electrical connection to this pin. 1 The exposed pad is required to be electrically and thermally connected to GND. Implement this by soldering the exposed pad to a GND PCB land that is the same size as the exposed pad. The GND PCB land should be robustly connected to the GND plane in the PCB for best electrical and thermal performance. No separate GND pins are provided in the package. Table 11. Pin Descriptions (Continued) Name Type State During/ After Reset Description The following symbols appear in the Type column of this table: A = asynchronous, I = input, O = output, S = synchronous, A/D = active drive, O/D = open drain, and T = three-state, ipd = internal pull-down resistor, ipu = internal pull-up resistor. The internal pull-up (ipu) and internal pull-down (ipd) resistors are designed to hold the internal path from the pins at the expected logic levels. To pull-up or pull-down the external pads to the expected logic levels, use external resistors. Internal pull-up/pull-down resistors cannot be enabled/disabled and the value of these resistors cannot be programmed. The range of an ipu resistor can be between 26 kΩ–63 kΩ. The range of an ipd resistor can be between 31 kΩ–85 kΩ. The three-state voltage of ipu pads will not reach to the full VDD_EXT level; at typical conditions the voltage is in the range of 2.3 V to 2.7 V. In this table, all pins are LVTTL compliant with the exception of the thermal diode pins. |
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