MMM6025 datasheet(4/16 Pages) FREESCALE

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MMM6025 Advance Information, Rev. 5.1

Freescale Semiconductor

RF Specifications

The following table provides additional details on MMM6025 orderable parts.

RF Specifications

This section details specifications for the EGSM, DCS, GSM850, and PCS bands.

BAND SELECT Current Level

High

Low

ILOWB_HIGH(H)

ILOWB_HIGH(L)

µA

Total module leakage current (Standby condition)

EN_DET_PA = 0.3 V

EUB_US = EN_ANT_TX = +0.3 V

LOWB_HIGH = 0.3 V

VAPC = 0.1 V

VREG_IN = 0 V or 2.775 V

Temp = 23 to 27

°C

Vdd = 3.8 V

IVdd(off)

5.0

7.0

µA

1 The MMM6025 pinout is compatible with that of MMM6022, except pin 8.

MMM6025 signal EN_DET_PA (pin 16) is equivalent to a combination of both MMM6022 signals EN_TX and EN_DET.

Table 4. Orderable Parts Details

Device

Operating

Temp. Range

(TA)

Package

RoHS

Compliant

Pb-Free

MSLLevel

SolderTemp.

MMM6025

–20

° to 70°C

HDI Module

Yes

250 °C

MMM6025R2

–20

° to 70°C

HDI Module

Tape and Reel

Yes

250 °C

Table 5. EGSM Band Specifications

Characteristic

Symbol

Min

Typ

Max

Unit

EGSM BAND (Pin = 5.0 to 11 dBm, Vdd = 3.2 Vdc, VAPC = 0.1 to 2.2 V pulsed, 25% duty cycle,

LOWB_HIGH = Low, EUB_US = Low, TC = 25°C ±5°C, unless otherwise noted.)

Operating Frequency

Transmit

Receive

880

925

915

960

MHz

Power Out

Po(max)

dBm

Power Out Low Voltage (Vdd = 2.8 V)

Po(min)

dBm

Power Added Efficiency (Saturated Pout)

PAE

Power Control Range1

Po(range)

Power Control Slope2

∆V

det/∆VAPC

3.0

V/V

Table 3. DC Specifications (continued)

Characteristic

Symbol

Min

Typ

Max

Unit

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