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TMUX7219 Datasheet(PDF) 32 Page - Texas Instruments

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Part # TMUX7219
Description  TMUX7219 44-V, Latch-Up Immune, 2:1 (SPDT) Precision Switch with 1.8-V Logic
PDF  38 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TMUX7219 Datasheet(HTML) 32 Page - Texas Instruments

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11 Layout
11.1 Layout Guidelines
When a PCB trace turns a corner at a 90° angle, a reflection can occur. A reflection occurs primarily because of
the change of width of the trace. At the apex of the turn, the trace width increases to 1.414 times the width. This
increase upsets the transmission-line characteristics, especially the distributed capacitance and self–inductance
of the trace which results in the reflection. Not all PCB traces can be straight and therefore some traces must
turn corners. Figure 11-1 shows progressively better techniques of rounding corners. Only the last example
(BEST) maintains constant trace width and minimizes reflections.
WORST
BETTER
BEST
1W min.
W
Figure 11-1. Trace Example
Route high-speed signals using a minimum of vias and corners which reduces signal reflections and impedance
changes. When a via must be used, increase the clearance size around it to minimize its capacitance. Each via
introduces discontinuities in the signal’s transmission line and increases the chance of picking up interference
from the other layers of the board. Be careful when designing test points, through-hole pins are not
recommended at high frequencies.
Figure 11-2 illustrates an example of a PCB layout with the TMUX7219. Some key considerations are:
• Decouple the supply pins with a 0.1-µF and 1 µF capacitor, placed lowest value capacitor as close to the pin
as possible. Make sure that the capacitor voltage rating is sufficient for the supply voltage.
• Keep the input lines as short as possible.
• Use a solid ground plane to help reduce electromagnetic interference (EMI) noise pickup.
• Do not run sensitive analog traces in parallel with digital traces. Avoid crossing digital and analog traces if
possible, and only make perpendicular crossings when necessary.
• Using multiple vias in parallel will lower the overall inductance and is beneficial for connection to ground
planes.
11.2 Layout Example
D
S1
GND
SEL
VDD
TMUX721 9
EN
Wide (low inductance)
trace for power
VSS
S2
C
Via to g round pla ne
Wide (low inductance)
trace for power
C
Figure 11-2. TMUX7219 Layout Example
TMUX7219
SCDS407A – JANUARY 2019 – REVISED NOVEMBER 2020
www.ti.com
32
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Copyright © 2020 Texas Instruments Incorporated
Product Folder Links: TMUX7219



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