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EV6R11 Datasheet(PDF) 5 Page - IXYS Corporation |
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EV6R11 Datasheet(HTML) 5 Page - IXYS Corporation |
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5 / 7 page  5 EV6R11 KIT OPERATION: For performance evaluation and power system design please note the following: a) The assembled board can be run with the IXDP630 removed by applying complemen- tary 5V square waves with proper "dead time" to the input pins HIN (P1-2) and LIN (P1-3). For standard IXDP630 operation, the values of R3 and C5 have been listed on the bill of materials. These values are for demon- stration, which may not be appropriate for your application and can be changed as needed. For IXDP631 operation, load R3, C5, C6 with the recommended load components as out- lined in the IXDP630/631 data sheet along with the crystal at the frequency of choice. R3 and C5 serve a dual purpose depending on which dead timer is used. The IXDP630 is hardwired for phase 'R' operation, see 630/631 data sheet, with pins OUTENA, ENAR, and RESET tied high. PWM drive input signal for ' R' phase is ap- plied to P1-6. To add phases 'S' and/or 'T', enable phases with jumpers at JP1 and/or JP2 and apply PWM phase drive signals to TP5 and/or TP6 taking the respective complementary outputs from TP1 through TP4. Note that TP1- TP6 are through-hole pads that have been added to the board to serve as convenient solder and/or test points. b) The IX6R11 provides a wide range of flexibility with its power supply requirements. However, threshold levels must be observed in the relationship between Vdd to HIN and LIN when selecting power supply values in the final design. Device propagation delays can also be minimized by observing relative values between supplies. c) Be careful with ground connections. Avoid ground loops. In general, connect the grounds as shown in Figure 4 to minimize ground bounce effects. This is particularly important when three "High/Low side driver design kits" are connected together with a single IXDP630 to form a three phase drive system, such as that shown in Figure 5. d) Before using the PCB at full power or at- tempting a short circuit test, make sure that a proper high voltage electrolytic capacitor is connected between DC BUS and GND as shown in Figure 4. The leads to this capacitor should be as short as possible to minimize any stray inductance. e) Figure 4 shows the load terminated at point A. This point could be connected to a number of places depending on the application. For example: Connection to ground will test the high side device. Connection to DC BUS will test the low side device. It could also be con- nected to the center point of a capacitive divider (UPS systems). f) Figure 5 shows a three phase power system implementation with a load configured in a Y (star). It could also be configured in a DELTA configuration. Please note the grounding scheme. Cut the connection between "ground plane 2" and "ground plane 4" on the compo- nents side of the PCB and solder a 10 Ohm resistor between these ground planes. The GND of each board is terminated to a single ground point. |
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