6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Supply Voltage

–0.3

22

V

Analog Inputs,

–30

30

V

Common - mode

–20

122

V

Output

GND – 0.3

Vs + 0.3

V

Operating Temperature

–55

150

°C

Junction temperature

150

°C

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

VIN+ and VIN– are the voltages at the VIN+ and VIN– pins, respectively.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human body model (HBM), per AEC Q100-002, all pins(1)

HBM ESD Classification Level 2

±2000

V

Charged device model (CDM), per AEC Q100-011, all pins

CDM ESD Classification Level C6

±1000

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Common-mode input range(1)

48

120

V

Operating supply range

2.7

5

20

V

Ambient temperature

–40

125

°C

(1)

6.4 Thermal Information

THERMAL METRIC(1)

INA280-Q1

UNIT

DCK (SC-70)

5 PINS

Junction-to-ambient thermal resistance

191.6

°C/W

Junction-to-case (top) thermal resistance

144.4

°C/W

Junction-to-board thermal resistance

69.2

°C/W

Junction-to-top characterization parameter

46.2

°C/W

Junction-to-board characterization parameter

69.0

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

INA280-Q1

SBOSA48 – NOVEMBER 2020

www.ti.com

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