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LT8393EUFDM Datasheet(PDF) 12 Page - Analog Devices |
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LT8393EUFDM Datasheet(HTML) 12 Page - Analog Devices |
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12 / 32 page ![]() LT8393 12 Rev. A For more information www.analog.com PIN FUNCTIONS PWM: PWM Dimming Input. The PWM pin can be used in two ways: external PWM dimming and internal PWM dimming. For external PWM dimming, drive this pin with a digital pulse from 0V to a voltage higher than 1.5V to control PWM dimming of the LED string. Make sure the RP pin is tied to ground in this case. For internal PWM dimming, apply an analog voltage between 1V and 2V to generate an internal digital pulse by comparing with the internal ramp. If PWM dimming is not used, tie this pin to INTVCC. Forcing the pin low turns off TG1 and TG2, turns on BG1 and BG2, disconnects the VC pin from all internal loads, and turns off PWMTG. PWMTG: PWM Dimming Top Gate Drive. A buffered and inverted version of the PWM input signal, the PWMTG pin drives an external high side PMOS PWM switch with a voltage swing from the higher voltage of (VOUT –10V) and 1V to VOUT. Leave this pin unconnected if not used. VOUT: Output Supply. The VOUT pin must be tied to the power output to determine the buck, buck-boost, or boost operation regions. The VOUTpinalsoservesaspositiverail for the PWMTG drive. Locally bypass this pin to ground with a minimum 1µF ceramic capacitor. BST2: Boost Side Bootstrap Floating Driver Supply. The BST2 pin requires an external bootstrap Schottky diode from the INTVCC pin and requires an external bootstrap capacitor to the SW2 pin. TG2: Boost Side Top Gate Drive. Drives the gate of boost side top N-Channel MOSFET with a voltage swing from SW2 to BST2. SW2: Boost Side Switch Node. BG2: Boost Side Bottom Gate Drive. Drives the gate of boost side bottom N-Channel MOSFET with a voltage swing from ground to INTVCC. INTVCC: Internal 5V Linear Regulator Output. The INTVCC linear regulator is supplied from the VIN pin, and powers the internal control circuitry and gate drivers. Locally bypass this pin to ground with a minimum 4.7µF ceramic capacitor. BG1: Buck Side Bottom Gate Drive. Drives the gate of buck side bottom N-channel MOSFET with a voltage swing from ground to INTVCC. SW1: Buck Side Switch Node. TG1: Buck Side Top Gate Drive. Drives the gate of buck side top N-channel MOSFET with a voltage swing from SW1 to BST1. BST1: Buck Side Bootstrap Floating Driver Supply. The BST1 pin has an integrated bootstrap Schottky diode from the INTVCC pin and requires an external bootstrap capacitor to the SW1 pin. LSN: Negative Terminal of the Buck Side Inductor Current Sense Resistor (RSENSE). Ensure accurate current sense with Kelvin connection. LSP: Positive Terminal of the Buck Side Inductor Current Sense Resistor (RSENSE). Ensure accurate current sense with Kelvin connection. VIN: Input Supply. The VIN pin must be tied to the power inputtodeterminethebuck,buck-boost,orboostoperation regions. Locally bypass this pin to ground with a minimum 1µF ceramic capacitor. GND (Exposed Pad): Ground. Solder the exposed pad directly to the ground plane. |
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