Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 1

3 Description.......................................................................1

4 Revision History.............................................................. 2

5 Pin Configuration and Function.....................................3

6 Specifications.................................................................. 5

6.1 Absolute Maximum Ratings........................................ 5

6.2 ESD Ratings............................................................... 5

6.3 Recommended Operating Conditions.........................5

6.4 Thermal Information....................................................5

6.5 Electrical Characteristics.............................................6

6.6 Typical Characteristics................................................ 7

7 Parameter Measurement Information............................ 8

7.1 Test Timing Diagrams................................................. 8

8 Detailed Description......................................................10

8.1 Overview................................................................... 10

8.2 Functional Block Diagram......................................... 10

8.3 Feature Description...................................................10

8.4 Device Functional Modes..........................................11

9 Application and Implementation.................................. 12

9.1 Application Information............................................. 12

9.2 Typical Application.................................................... 13

10 Layout...........................................................................16

10.1 Layout Guidelines................................................... 16

10.2 Layout Example...................................................... 16

11 Device and Documentation Support..........................17

11.1 Receiving Notification of Documentation Updates.. 17

11.2 Community Resource..............................................17

11.3 Trademarks............................................................. 17

12 Mechanical, Packaging, and Orderable

Information.................................................................... 17

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision C (October 2016) to Revision D (December 2020)

Page

• NOTE: The device in the MicroStar Jr. BGA packaging were redesigned using a laminate nFBGA package.

This nFBGA package offers datasheet-equivalent electrical performance. It is also footprint equivalent to the

MicroStar Jr. BGA. The new package designator in place of the discontinued package designator will be

updated throughout the datasheet......................................................................................................................1

• Changed u*jr BGA to nFBGA............................................................................................................................. 1

• Changed u*jr ZQE to nFBGA ZXH. Updated thermal information...................................................................... 5

• Corrected typo from HD3SS3412 to HD3SS212.............................................................................................. 16

Changes from Revision B (January 2014) to Revision C (October 2016)

Page

• Added Device Information table, ESD Ratings table, Feature Description section, Device Functional Modes,

Application and Implementation section, Power Supply Recommendations section, Layout section, Device

and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. .......... 1

• Deleted Ordering Information table. See POA at the end of the datasheet. ......................................................1

Changes from Revision A (March 2012) to Revision B (January 2014)

Page

• Changed OE to OE throughout document..........................................................................................................1

Changes from Revision * (December 2011) to Revision A (March 2012)

Page

• Changed Description From: full industrial temperature range of –40°C to 85°C To: full industrial temperature

range of –40°C to 105°C.....................................................................................................................................1

• Added Operating Temperature to the Abs Max Table.........................................................................................5

• Changed the Operating free-air temperature From MAX = 85°C To: 105°C...................................................... 5

• Changed the MAX value of Leakage current (Dx_SEL), VDD = 0 V From: 8µA To: 10µA................................. 6

HD3SS212

SLAS822D – DECEMBER 2011 – REVISED DECEMBER 2020

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