TMUX7208 datasheet(39/51 Pages) TI

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11 Power Supply Recommendations

The TMUX7208 and the TMUX7209 operate across a wide supply range of of ±4.5 V to ±22 V (4.5 V to 44 V in

single-supply mode). The device also perform well with asymmetrical supplies such as VDD = 12 V and VSS = –5

Power-supply bypassing improves noise margin and prevents switching noise propagation from the supply

rails to other components. Good power-supply decoupling is important to achieve optimum performance. For

improved supply noise immunity, use a supply decoupling capacitor ranging from 0.1 μF to 10 μF at the VDD and

VSS pins to ground. Place the bypass capacitors as close to the power supply pins of the device as possible

using low-impedance connections. TI recommends using multi-layer ceramic chip capacitors (MLCCs) that

offer low equivalent series resistance (ESR) and inductance (ESL) characteristics for power-supply decoupling

purposes. For very sensitive systems, or for systems in harsh noise environments, avoiding the use of vias

for connecting the capacitors to the device pins may offer superior noise immunity. The use of multiple vias

in parallel lowers the overall inductance and is beneficial for connections to ground and power planes. Always

ensure the ground (GND) connection is established before supplies are ramped.

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TMUX7208, TMUX7209

SCDS418B – JULY 2020 – REVISED APRIL 2021

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TMUX7208 Datasheet(PDF) 39 Page - Texas Instruments