TMUX7208 datasheet(7/51 Pages) TI

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7.3 Thermal Information

THERMAL METRIC(1)

TMUX720x

UNIT

PW (TSSOP)

RUM (WQFN)

16 PINS

RθJA

Junction-to-ambient thermal resistance

93.5

41.2

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

24.9

24.5

°C/W

RθJB

Junction-to-board thermal resistance

40.0

16.1

°C/W

ΨJT

Junction-to-top characterization parameter

1.0

0.2

°C/W

ΨJB

Junction-to-board characterization parameter

39.4

16.1

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

2.8

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VDD – VSS (1) Power supply voltage differential

4.5

VDD

Positive power supply voltage

4.5

VS or VD

Signal path input/output voltage (source or drain pin) (Sx, D)

VSS

VDD

VSEL or VEN

Address or enable pin voltage

IS or ID (CONT) Source or drain continuous current (Sx, D)

IDC (2)

Ambient temperature

–40

125

°C

(1)

VDD and VSS can be any value as long as 4.5 V ≤ (VDD – VSS) ≤ 44 V, and the minimum VDD is met.

(2)

Refer to Source or Drain Continuous Current table for IDC specifications.

7.5 Source or Drain Continuous Current

at supply voltage of VDD ± 10%, VSS ± 10 % (unless otherwise noted)

CONTINUOUS CURRENT PER CHANNEL (IDC)

TA = 25°C

TA = 85°C

TA = 125°C

UNIT

PACKAGE

TEST CONDITIONS

PW (TSSOP)

+44 V Dual Supply(1)

300

190

110

±15 V Dual Supply

300

190

110

+12 V Single Supply

220

150

±5 V Dual Supply

210

140

+5 V Single Supply

170

110

RUM (WQFN)

+44 V Single Supply(1)

400

230

120

±15 V Dual Supply

400

230

120

+12 V Single Supply

310

190

100

±5 V Dual Supply

300

190

100

+5 V Single Supply

230

150

(1)

Specified for nominal supply voltage only.

www.ti.com

TMUX7208, TMUX7209

SCDS418B – JULY 2020 – REVISED APRIL 2021

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