TMUX7208 datasheet(6/51 Pages) TI

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1) (2)

MIN

MAX

UNIT

VDD – VSS

Supply voltage

VDD

–0.5

VSS

–48

0.5

VSEL or VEN

Logic control input pin voltage (EN, A0, A1, A2)

–0.5

ISEL or IEN

Logic control input pin current (EN, A0, A1, A2)

–30

VS or VD

Source or drain voltage (Sx, D)

VSS–0.5

VDD+0.5

IIK

Diode clamp current(3)

–30

IS or ID (CONT)

Source or drain continuous current (Sx, D)

IDC + 10 %(4)

Ambient temperature

–55

150

°C

Tstg

Storage temperature

–65

150

°C

Junction temperature

150

°C

Ptot

Total power dissipation (QFN package)(5)

1650

Total power dissipation (TSSOP package)(5)

700

(1)

Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated

under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

All voltages are with respect to ground, unless otherwise specified.

(3)

Pins are diode-clamped to the power-supply rails. Over voltage signals must be voltage and current limited to maximum ratings.

(4)

Refer to Source or Drain Continuous Current table for IDC specifications.

(5)

For QFN package: Ptot derates linearily above TA = 70°C by 24.4mW/°C.

For TSSOP package: Ptot derates linearily above TA = 70°C by 10.8mW/°C.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/

JEDEC JS-001, all pins(1)

±2000

Charged device model (CDM), per JEDEC

specification JESD22-C101, all pins(2)

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

TMUX7208, TMUX7209

SCDS418B – JULY 2020 – REVISED APRIL 2021

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