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XD9268 Datasheet(PDF) 16 Page - Torex Semiconductor |
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XD9268 Datasheet(HTML) 16 Page - Torex Semiconductor |
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16 / 26 page ![]() 16/26 XD9267/XD9268 Series ■NOTES ON USE (Continued) 6) Even in the PWM control, the intermittent operation occurs and the ripple voltage becomes higher, when the minimum On Time is faster than 85ns (typ.) as well as the dropout voltage is large and output current is small. 7) The ripple voltage could be increased when switching from discontinuous conduction mode to continuous conduction mode and at switching to 100% Duty cycle. Please evaluate IC well on customer’s PCB. 8) The PWM/PFM auto series may cause superimposed ripple voltage by continuous pulses if used in high temperature and no load conditions. It is necessary to set an idle current of higher than 100μA from VOUT if used at no load. It can have the same effect as when RFB2 is lower than 7.5kΩ. Please refer to the < Output Voltage Setting Value VOUTSET Setting > section under TYPICAL APPLICATION CIRCUIT. 9) If the voltage at the EN/SS Pin does not start from 0V but it is at the midpoint potential when the power is switched on, the soft start function may not work properly and it may cause the larger inrush current and bigger ripple voltages. 10) Torex places an importance on improving our products and their reliability. We request that users incorporate fail-safe designs and post-aging protection treatment when using Torex products in their systems. 11) Instructions of pattern layouts The operation may become unstable due to noise and/or phase lag from the output current when the wire impedance is high, please place the input capacitor(CIN) and the output capacitor (CL) as close to the IC as possible. (1) In order to stabilize VIN voltage level, we recommend that a by-pass capacitor (CIN) be connected as close as possible to the VIN and GND pins. (2) Please mount each external component as close to the IC as possible. Please place the external parts on the same side of the PCB as the IC, not on the reverse side of the PCB and elsewhere. (3) Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit Impedance. (4) Make sure that the GND traces are as thick as possible, as variations in ground potential caused by high ground currents at the time of switching may result in instability of the IC. (5) Please note that internal driver transistors bring on heat because of the load current and ON resistance of High side driver transistor, Low side driver transistor. Please make sure that the heat is dissipated properly, especially at higher temperatures. Lx PG FB GN D VIN EN/SS CL1 L RFB1 RFB2 CFB RPG (a)TVS (1)C IN1 (c)Reverse-Touching Prot ection Diode (b)SBD C IN2 CL2 |
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