XDL604 datasheet(19/28 Pages) TOREX

19 / 28 page

19/28

XDL603/XDL604

Series

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NOTES ON USE(Continued)

10)

Instructions of pattern layouts

The operation may become unstable due to noise and/or phase lag from the output current when the wire impedance is high,

please place the input capacitor(CIN1,CIN2) and the output capacitor (CL) as close to the IC as possible.

(1) In order to stabilize VIN voltage level, we recommend that a by-pass capacitor (CIN2) be connected as close as possible

to the VIN and GND pins.

(2) Please mount each external component as close to the IC as possible.

Please place the external parts on the same side of the PCB as the IC, not on the reverse side of the PCB and elsewhere.

(3) Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit

impedance.

(4) Make sure that the GND traces are as thick as possible, as variations in ground potential caused by high ground

currents at the time of switching may result in instability of the IC.

(5) This product has a built-in driver FET and inductor, which causes heat generation from the on resistance, so take

measures to dissipate the heat when necessary.

XDL604 Datasheet(PDF) 19 Page - Torex Semiconductor