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Data Sheet

ADMV7320

Rev. C | Page 5 of 29

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

VD_AMP

4.5 V

VD_MULT

3 V

VGA_VD12, VGA_VD345, and VGA_VD6

4.5 V

PA_VD1 and PA_VD2

4.5 V

VG_AMP

−3 V to +0.2 V

VG_MULT

−3 V to +0.2 V

VGA_VG12, VGA_VG345, and VGA_VG6

−3 V to +0.2 V

PA_VG1 and PA_VG2

−3 V to +0.2 V

VGA_CTL12

−6 V to 0 V

LO Drive

10 dBm

Baseband Input (IF_IP, IF_IN, IF_QP, and

IF_QN)

4 dBm

IF Source and Sink Current

3 mA

Nominal Junction Temperature (TA = 85°C)

160°C

Maximum Junction Temperature

(to Maintain 1 Million Hours Mean Time

to Failure (MTTF))

190°C

Maximum Junction Temperature

(to Maintain 3 Million MTTF)

175°C

Operating Temperature Range

−40°C to +85°C

Storage Temperature Range

−55°C to +150°C

Maximum Peak Reflow Temperature

(Moisture Sensitivity Level 3 (MSL3))

260°C

Thermal Humidity Bias (THB)

JESD22-A1011, 2, 3

Thermal Humidity Storage (THS)

JESD22-A1011, 3

Electrostatic Discharge (ESD) Sensitivity

Human Body Model (HBM)

200 V

Field Induced Charged Device Model

(FICDM)

300 V

1 Samples subject to preconditioning (per J-STD-020 Level 3) prior to the start

of the stress test. Level 3 preconditioning consists of the following: bake for

24 hours at 125°C, unbiased soak for 192 hours at 30°C and 60% relative

humidity (RH), and reflow of three passes through an oven with a peak

temperature of 260°C.

2 Results valid for 600 mW of nominal dc power dissipation for all active

devices. Analog Devices, Inc., recommends that users perform their own THB

test for all other bias conditions.

3 Valid for package vent hole solder sealed or unsealed during test.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

θJC is the junction to case (or die to package) thermal resistance.

Table 3. Thermal Resistance1

Package Type

θJC

Unit

CE-50-2

°C/W

1 Thermal impedance simulated values are based on a JEDEC 2S2P test board

with 16 mm × 14 mm thermal vias. Refer to JEDEC standard JESD51-2 for

additional information.

ESD CAUTION

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