LAN9255

DS00003646B-page 18

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2020-2021 Microchip Technology Inc.

FIGURE 5-3:

128-TQFP PACKAGE (LAND PATTERN)

RECOMMENDED LAND PATTERN

Dimension Limits

Units

C2

Optional Center Pad Width

Contact Pad Spacing

Optional Center Pad Length

Contact Pitch

Y2

X2

9.10

9.10

MILLIMETERS

0.40 BSC

MIN

E

MAX

15.40

Contact Pad Length (X128)

Contact Pad Width (X128)

Y1

X1

1.50

0.20

NOM

C1

Contact Pad Spacing

15.40

Contact Pad to Contact Pad (X124)

G2

0.20

Thermal Via Diameter

V

Thermal Via Pitch

EV

0.33

1.20

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

1.

2.

Contact Pad to Center Pad (X128)

G1

2.40

Microchip Technology Drawing C04-2502 Rev A

C1

C2

E

X1

Y1

G1

G2

ØV

X2

Y2

EV

EV

SILK SCREEN

1

2

332

65

96

97

128

33

64