MAX22288

Home Bus System (HBS) Compatible Transceiver

www.maximintegrated.com

Maxim Integrated | 2

Absolute Maximum Ratings

AIO, BIO, TERM to GND ...................................-0.3V to +6.0V

,

, TVL, TVT to GND .....................-0.3V to +6.0V

DIN, DOUT, RST to GND ..................................-0.3V to +6.0V

Continuous Current Into Any Pin

Continuous Power Dissipation

+70°C) .................................................................. 1666.70mW

+70°C) .................................................................. 2222.20mW

Temperature Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or

any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Information

24-Pin TQFN

Package Code

T2444+4C

Outline Number

21-0139

Land Pattern Number

90-0022

Thermal Resistance, Single-Layer Board:

Junction-to-

Ambient (θJA)

48°C/W

Junction-to-

Case Thermal Resistance (θJC)

3°C/W

Thermal Resistance, Four-Layer Board:

Junction-to-

Ambient (θJA)

36°C/W

Junction-to-Case Thermal

Resistance (θJC)

3°C/W

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed

information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.

For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages

. Note that a “+”, “#”, or “-”

in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the

package regardless of RoHS status.