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MPC8548EEC Datasheet(PDF) 91 Page - NXP Semiconductors |
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MPC8548EEC Datasheet(HTML) 91 Page - NXP Semiconductors |
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91 / 151 page  MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 91 Package Description 19 Package Description This section details package parameters, pin assignments, and dimensions. 19.1 Package Parameters The package parameters for both the HiCTE FC-CBGA and FC-PBGA are provided in Table 70. Table 70. Package Parameters Parameter CBGA1 PBGA2 Package outline 29 mm × 29 mm 29 mm × 29 mm Interconnects 783 783 Ball pitch 1 mm 1 mm Ball diameter (typical) 0.6 mm 0.6 mm Solder ball 63% Sn 37% Pb 0% Ag 63% Sn 37% Pb 0% Ag Solder ball (lead-free) 95% Sn 4.5% Ag 0.5% Cu 96.5% Sn 3.5% Ag Notes: 1. The HiCTE FC-CBGA package is available on only Version 2.0 of the device. 2. The FC-PBGA package is available on only versions 2.1.1 and 2.1.2, and 3.0 of the device. |
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