• Updated Migrating From the xx75 Device Family section to specify TMP1075 compatible packages ............27

• Included TMP1075N information to Power Supply Recommendations............................................................ 27

• Added figures to the Layout Example section for each package......................................................................28

Changes from Revision C (January 2019) to Revision D (October 2019)

Page

• Added software compatibility to feature list........................................................................................................ 1

• Updated absolute max for Power supply V+ to 6.5V from 6V.............................................................................6

• Updated absolute max for Input voltage on SCL, SDA, A1, A0 to 6.5V from 6V................................................6

• Updated pointer register to be part of the serial interface description.............................................................. 15

• Updated the register map table to new format..................................................................................................22

• Added access type codes for register bits........................................................................................................ 22

• Updated temperature register format and bit definition table............................................................................22

• Updated configuration register format and bit definition table ......................................................................... 23

• Updated low limit register format and bit definition table ................................................................................. 24

• Updated high limit register format and bit definition table ................................................................................24

• Updated device ID register format and bit definition table ............................................................................... 25

Changes from Revision B (December 2018) to Revision C (January 2019)

Page

• Changed TMP1075DSG package moved from Preview to Production Data......................................................1

• Changed min/max limit from 1.5°C to 1°C in the Temperature Accuracy (DGK & D) graph...............................1

• Changed min/max limit from 1.5°C to 1°C in the DGK & D Temperature Error vs. Temperature graph........... 11

• Added DSG Temperature Error vs. Temperature graph ...................................................................................11

Changes from Revision A (June 2018) to Revision B (December 2018)

Page

• Added TMP1075DSG package ......................................................................................................................... 1

• Updated description section of the data sheet and added a Description (continued) section............................ 1

• Added TMP1075 configuration register support for single byte read and write................................................ 23

• Added Software support section for migrating from xx75 to TMP1075 ........................................................... 27

Changes from Revision * (March 2018) to Revision A (June 2018)

Page

• Changed the TMP1075DGK orderable status from Advanced Information to Production Data......................... 1

• Added SOIC and DFN packages........................................................................................................................1

• Changed the Functional Block Diagram .......................................................................................................... 13

• Changed Digital Temperature Output crossreference from: Temperature Register (0x00) to: Temperature

Data Format .....................................................................................................................................................14

• Changed the Temperature Data Format table ................................................................................................. 14

• Changed and renamed the Address Pins and Slave Addresses for the TMP1075 table to Address Pins State

..........................................................................................................................................................................15

• Changed the Two-Wire Timing Diagrams section ............................................................................................18

• Added content to the Device Functional Modes section ..................................................................................20

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TMP1075

SBOS854E – MARCH 2018 – REVISED AUGUST 2021

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