8.4 Thermal Information

THERMAL METRIC(1)

TMP1075

TMP1075

TMP1075

TMP1075N

UNIT

DGK (VSSOP)

D (SOIC)

DSG (WSON)

DRL (SOT)

8 PINS

8 PINS

8 PINS

6 PINS

Junction-to-ambient thermal resistance

202.5

130.4

87.4

210.3

°C/W

Junction-to-case (top) thermal

resistance

82

76.9

111.1

105.0

°C/W

Junction-to-board thermal resistance

124.4

72.3

54

87.5

°C/W

Junction-to-top characterization

parameter

17.9

32

9.8

6.1

°C/W

Junction-to-board characterization

parameter

122.6

71.9

54.4

87.0

°C/W

Junction-to-case (bottom) thermal

resistance

__

__

28.1

__

°C/W

Thermal mass

16.6

64.2

5.0

__

mJ/°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

8.5 Electrical Characteristics:TMP1075

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

TEMPERATURE INPUT

Range

–55

125

°C

Accuracy

(temperature

error)

DGK, D

–40°C to +110°C

±0.25

±1

°C

–55°C to +125°C

±0.25

±2

DSG

–40°C to +75°C

±0.25

±1

°C

–55°C to +125°C

±0.25

±2

°C

Accuracy (temperature error)

vs. supply

PSRR

±0.03

°C/V

Resolution

1 LSB (12 bit)

0.0625

°C

Repeatability(1)

25°C, V+= 3.3 V(2)

0.0625

°C

Long-term drift(3)

500 hours at 150°C, 5.5V

0.0625

°C

DIGITAL INPUT/OUTPUT

Input capacitance

5

pF

High-level input logic

0.7(V+)

V

Low-level input logic

0.3(V+)

V

Leakage input current

–0.25

0

0.25

µA

Input voltage hysteresis

SCL and SDA pins

600

mV

Low-level output logic

0

0.15

0.4

V

ADC Conversion time

one-shot mode

4.5

5.5

7

ms

Conversion Time

R1 = 0, R0 = 0 (default)

27.5

ms

R1 = 0, R0 = 1

55

R1 = 1, R0 = 0

110

R1 = 1, R0 = 1

220

Reset time

The time between reset till ADC conversion start

0.3

ms

Conversion Rate Variation

–10

0

10

%

POWER SUPPLY

Operating voltage range

1.7

3.3

5.5

V

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TMP1075

SBOS854E – MARCH 2018 – REVISED AUGUST 2021

Copyright © 2021 Texas Instruments Incorporated

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