6.4 Thermal Information (continued)

THERMAL METRIC(1)

TPS22950

UNIT

YBH (WCSP)

6 PINS

Junction-to-board characterization parameter

39.5

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Electrical Characteristics

Unless otherwise noted, the characteristics in the following table apply across the recommended operating input voltage

PARAMETER

TEST CONDITIONS

MIN

TYP MAX UNIT

Input Supply (VIN)

VIN Quiescent Current

-40°C to 85°C

44

60

µA

-40°C to 125°C

60

µA

VIN Shutdown Current

25°C

0.2

0.4

µA

-40°C to 85°C

9

µA

-40°C to 125°C

46

µA

ON-Resistance (RON)

ON-State Resistance

25°C

34

41 mΩ

-40°C to 85°C

49 mΩ

-40°C to 125°C

54 mΩ

ON-State Resistance

25°C

41

51

mΩ

-40°C to 85°C

62

-40°C to 125°C

68

ON-State Resistance

25°C

67

90 mΩ

-40°C to 85°C

105 mΩ

-40°C to 125°C

116 mΩ

Output Current Limit (ILIM)

Output Current Limit

-40°C to 125°C

1.54

2

2.46

A

-40°C to 125°C

0.75

1

1.25

A

-40°C to 125°C

0.38

0.5

0.62

A

-40°C to 125°C

0.034

0.05 0.066

A

Current Limit Response

Time

-40°C to 125°C

5

µs

Reverse Current Blocking (RCB)

Activation Threshold

-40°C to 125°C

44

mV

Release Threshold

-40°C to 125°C

16

mV

Response Time

-40°C to 125°C

3

µs

Reverse Leakage Current

into VOUT

-40°C to 125°C

38

µA

Fault Indication (FLT)

Output Low Voltage

-40°C to 125°C

0.1

V

Fault Delay Time

-40°C to 125°C

10

µs

Off State Leakage

-40°C to 125°C

50

nA

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TPS22950

SLVSFJ2 – DECEMBER 2020

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