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PACKAGE OUTLINE

C

0.4 MAX

0.19

0.13

0.8

TYP

0.4

TYP

6X

0.225

0.185

0.4

TYP

B

E

A

D

4226594/A 03/2021

D: Max = 1.126 mm, Min = 1.086 mm

DSBGA - 0.4 mm max height

YBH0006-C02

DIE SIZE BALL GRID ARRAY

E: Max = 0.726 mm, Min = 0.686 mm

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

BALL A1

CORNER

SEATING PLANE

0.05 C

A

1

2

0.015

C A B

SYMM

SYMM

B

C

SCALE 12.000

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TPS22950

SLVSFJ2 – DECEMBER 2020

Copyright © 2021 Texas Instruments Incorporated

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