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OPA1677DBVT Datasheet(PDF) 5 Page - Texas Instruments

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Part # OPA1677DBVT
Description  OPA167x Low-Distortion Audio Operational Amplifiers
PDF  52 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

OPA1677DBVT Datasheet(HTML) 5 Page - Texas Instruments

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1
OUT A
14
OUT D
2
±IN A
13
±IN D
3
+IN A
12
+IN D
4
V+
11
V±
5
+IN B
10
+IN C
6
±IN B
9
±IN C
7
OUT B
8
OUT C
Not to scale
Figure 5-5. OPA1679 D (14-Pin SOIC) and
PW (14-Pin TSSOP) Packages, Top View
1
-IN A
12
-IN D
2
+IN A
11
+IN D
3
V+
10
V–
4
+IN B
9
+IN C
Not to scale
Thermal
Pad
Figure 5-6. OPA1679 RUM (16-Pin QFN With
Exposed Thermal Pad) Package, Top View
Pin Functions: OPA1679
PIN
TYPE
DESCRIPTION
NAME
NO.
D (SOIC)
PW (TSSOP)
RUM (QFN)
–IN A
2
1
Input
Inverting input, channel A
+IN A
3
2
Input
Noninverting input, channel A
–IN B
6
5
Input
Inverting input, channel B
+IN B
5
4
Input
Noninverting input, channel B
–IN C
9
8
Input
Inverting input, channel C
+IN C
10
9
Input
Noninverting input, channel C
–IN D
13
12
Input
Inverting input, channel D
+IN D
12
11
Input
Noninverting input, channel D
NC
—
13
—
No connect
NC
—
16
—
No connect
OUT A
1
15
Output
Output, channel A
OUT B
7
6
Output
Output, channel B
OUT C
8
7
Output
Output, channel C
OUT D
14
14
Output
Output, channel D
V+
4
3
Power
Positive (highest) power supply
V–
11
10
Power
Negative (lowest) power supply
Thermal Pad
—
Thermal pad
—
Exposed thermal die pad on underside. Connect thermal die pad to V–.
Solder the thermal pad to improve heat dissipation and provide specified
performance.
www.ti.com
OPA1677, OPA1678, OPA1679
SBOS855D – JANUARY 2017 – REVISED DECEMBER 2021
Copyright © 2021 Texas Instruments Incorporated
Submit Document Feedback
5
Product Folder Links: OPA1677 OPA1678 OPA1679



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