MAX11167 datasheet(2/28 Pages) MAXIM

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MAX11167

16-Bit, 250ksps, ±5V SAR ADC

with Internal Reference in TDFN

www.maximintegrated.com

VDD to GND ............................................................-0.3V to +6V

OVDD to GND....... -0.3V to the lower of (VDD + 0.3V) and +6V

AIN+ to GND ........................................................................ Q7V

AIN-, REF, REFIO, AGNDS

to GND............... -0.3V to the lower of (VDD + 0.3V) and +6V

SCLK, DIN, DOUT, CNVST

to GND............... -0.3V to the lower of (VDD + 0.3V) and +6V

Maximum Current into Any Pin...........................................50mA

Continuous Power Dissipation (TA = +70NC)

TDFN (derate 18.2mW/NC above +70NC)..................1349mW

Operating Temperature Range........................... -40NC to +85NC

Junction Temperature......................................................+150NC

Storage Temperature Range............................ -65NC to +150NC

Lead Temperature (soldering, 10s) .................................+300NC

Soldering Temperature (reflow).......................................+260NC

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation

of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum

rating conditions for extended periods may affect device reliability.

Electrical Characteristics

(VDD = 4.75V to 5.25V, VOVDD = 2.3V to 5.25V, fSAMPLE = 250ksps, VREF = 4.096V; TA = TMIN to TMAX, unless otherwise noted.

Typical values are at TA = +25NC.) (Note 2)

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to

www.maximintegrated.com/thermal-tutorial.

TDFN

Junction-to-Ambient Thermal Resistance (qJA).......59.3NC/W

Junction-to-Case Thermal Resistance (qJC) ...........22.5NC/W

Package Thermal Characteristics (Note 1)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

ANALOG INPUT (Note 3)

Input Voltage Range

AIN+ to AIN-, K =

-K x VREF

+K x VREF

Absolute Input Voltage Range

AIN+ to GND

-(VDD +

0.1)

+(VDD +

0.1)

AIN- to GND

-0.1

+0.1

Input Leakage Current

Acquisition phase

-10

+0.001

+10

µA

Input Capacitance

Input-Clamp Protection Current

Both inputs

-20

+20

STATIC PERFORMANCE

Resolution

Bits

No Missing Codes

Bits

Offset Error

-7.5

±0.7

+7.5

LSB

Offset Temperature Coefficient

±0.006

LSB/°C

Gain Error

-3.5

±1.6

+3.5

LSB

Gain Error Temperature

Coefficient

±0.007

LSB/°C

Integral Nonlinearity

INL

-1.2

±0.4

+1.2

LSB

Differential Nonlinearity

DNL

Guaranteed by design

-0.5

±0.2

+0.5

LSB

Positive Full-Scale Error

-8

LSB

5.000

4.096

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