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MIC5801 Datasheet(PDF) 12 Page - Microchip Technology |
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MIC5801 Datasheet(HTML) 12 Page - Microchip Technology |
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12 / 22 page ![]() MIC5800/1 DS20006184B-page 12 2019 - 2022 Microchip Technology Inc. RECOMMENDED LAND PATTERN Dimension Limits Units Contact Pitch MILLIMETERS 1.27 BSC MIN E MAX Contact Pad Length (X14) Contact Pad Width (X14) Y X 1.55 0.60 NOM C Contact Pad Spacing 5.40 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M 1. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: E X Y C SILK SCREEN Microchip Technology Drawing No. C04-2065-D3X Rev D 12 14 14-Lead Plastic Small Outline (D3X, UEB, M5B, UEB) - Narrow, 3.90 mm Body [SOIC] Atmel Legacy Global Package Code SVQ |
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