11

Package Information

Symbol

Parameter

Unit

Typ.

Max.

Thermal Resistance, Junction to Case

°C/W

9.5

—

Note: Based on independent testing by Agilent.

θ

θ

is the case temperature measured on the top center of the package, and P

dissipated.

Item

Details

Package Material

Plastic

Lead Finish Material

85% Tin, 15% Lead

Lead Finish Thickness

300 – 800 micro-inches

Lead Skew

0.20 mm max.

Lead Coplanarity

0.10 mm max.

(Seating Plane Method)

Figure 10. HDMP-0482 Package Drawing.

Mechanical Dimensions of HDMP-0482

Dimensional Parameter

D1/E1

D/E

b

e

L

c

G

A2

A1

A

(in millmeters)

HDMP-0482

14.00

17.20

0.35

0.80

0.88

0.17

0.25

2.00

0.25

2.35

Max

Tolerance

±0.10

±0.25

±0.05

Basic

+0.15/

Max

Gage

+0.10/

Max

-0.10

Plane

-0.05

PIN #1 ID

E

E1

D

D1

e

b

c

A1

A2

L

G

A

HDMP-0482

TOP VIEW

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49

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