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SC18IS604 Datasheet(PDF) 2 Page - NXP Semiconductors |
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SC18IS604 Datasheet(HTML) 2 Page - NXP Semiconductors |
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2 / 29 page ![]() NXP Semiconductors SC18IS604 SPI to I2C-bus bridge 3 Ordering information Package Type number Topside marking Name Description Version SC18IS604PW 18IS604 TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 Table 1. Ordering information 3.1 Ordering options Type number Orderable part number Package Packing method Minimum order quantity Temperature SC18IS604PW SC18IS604PWJ TSSOP16 REEL 13" Q1 *STANDARD MARK SMD [1] 2500 Tamb = -40 °C to +105 °C Table 2. Ordering options [1] Find packing information at www.nxp.com/docs/en/packing/SOT403-1_118.pdf 4 Block diagram SC18IS604 RESET aaa-039901 CONTROL LOGIC MOSI SPI SCLK CS MISO INTERRUPT CONTROL LOGIC INT OSCILLATOR BUFFER I2C-BUS CONTROLLER GENERAL PURPOSE I/Os GPIO0 SDA SCL GPIO1 GPIO2 GPIO3 ON-CHIP RC OSCILLATOR GPIO4 Figure 1. Block diagram of SC18IS604 SC18IS604 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2021. All rights reserved. Product data sheet Rev. 1.0 — 22 September 2021 2 / 29 |
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