SC18IS604 datasheet(28/29 Pages) NXP

28 / 29 page

NXP Semiconductors

SC18IS604

SPI to I2C-bus bridge

Tables

Tab. 1.

Ordering information ..........................................2

Tab. 2.

Ordering options ................................................2

Tab. 3.

Pin description ...................................................3

Tab. 4.

Internal registers summary ................................4

Tab. 5.

Pin configurations ..............................................4

Tab. 6.

IOState - I/O pins state register (address

0x01) bit description ..........................................6

Tab. 7.

I2C-bus clock frequency ....................................6

Tab. 8.

I2CTO - I2C-bus timeout register (address

0x04) bit description ..........................................6

Tab. 9.

I2C-bus status ................................................... 7

Tab. 10. SPI configuration .............................................11

Tab. 11. Limiting values ................................................ 14

Tab. 12. Static characteristics ....................................... 14

Tab. 13. Dynamic characteristics .................................. 15

Tab. 14. Additional SPI AC characteristics ....................16

Tab. 15. I2C-bus timing characteristics ......................... 17

Tab. 16. SnPb eutectic process (from J-STD-020D) ..... 24

Tab. 17. Lead-free process (from J-STD-020D) ............24

Tab. 18. Abbreviations ...................................................25

Tab. 19. Revision history ...............................................25

Figures

Fig. 1.

Block diagram of SC18IS604 ............................2

Fig. 2.

SC18IS604 pin configuration for TSSOP16 .......3

Fig. 3.

Open-drain output configuration ........................5

Fig. 4.

Input-only configuration .....................................5

Fig. 5.

Push-pull output configuration ...........................5

Fig. 6.

I2C-bus configuration ........................................ 8

Fig. 7.

SPI single master multiple slaves

configuration ......................................................9

Fig. 8.

Write N bytes to I2C-bus target device ..............9

Fig. 9.

Read N bytes from I2C-bus target device ....... 10

Fig. 10.

I2C-bus read after write .................................. 10

Fig. 11.

Read buffer ..................................................... 10

Fig. 12.

Write after write ...............................................11

Fig. 13.

SPI configuration .............................................11

Fig. 14.

Write to SC18IS604 internal registers ............. 12

Fig. 15.

Read from SC18IS604 internal register ...........12

Fig. 16.

Deep Power-down mode .................................13

Fig. 17.

SPI slave timing (Mode 3) ...............................16

Fig. 18.

SPI to I2C-bus timing diagram ........................ 16

Fig. 19.

I2C-bus timing ................................................. 17

Fig. 20.

Package outline SOT403-1 (TSSOP16) ..........18

Fig. 21.

SOT403-1 (TSSOP16) footprint information

for reflow soldering ..........................................19

Fig. 22.

SOT403-1 (TSSOP16) solder mask

opening pattern ............................................... 20

Fig. 23.

SOT403-1 (TSSOP16) I/O pads and

solderable area ............................................... 21

Fig. 24.

SOT403-1 (TSSOP16) Solder paste stencil .... 22

Fig. 25.

Temperature profiles for large and small

components .....................................................25

SC18IS604

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Product data sheet

Rev. 1.0 — 22 September 2021

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