24LC64 datasheet(46/51 Pages) MICROCHIP

46 / 51 page

24AA64/24FC64/24LC64

DS20001189U-page 46

 1997-2022 Microchip Technology Inc. and its subsidiaries

APPENDIX A: REVISION HISTORY

Revision U (0

3/2022)

Added Product Identification System section for Auto-

motive; Updated DFN, PDIP, SOIC, SOT-23, TDFN

and TSSOP package drawings; Added DFN-S product

offering; Replaced terminology “Master” and “Slave”

with “Host” and “Client”, respectively; Replaced “Auto-

motive (E):” designation with “Extended (E):” designa-

tion; Reformatted some sections for better readability.

Revision T (12/2012)

Revised automotive E-temp; Product ID System.

Revision S (01/2012)

Updated package drawings: Updated Product ID.

Revision R (03/2010)

Added TSSOP X-Rotated package; Updated package

drawings; Updated Product ID.

Revision Q (06/09)

Revised Features section; Revised Table 1-2, Para. 18;

Added note to Table 2-1; Revised SOT-23 package

example.

Revision P (03/2009)

Added 5-lead Chip Scale Package Diagram and Land

Pattern; Revised Block Diagram.

Revision N (03/2009)

Added 5-lead Chip Scale package.

Revision M (01/2009)

Updated package drawings; Added 8-lead TDFN and

5-lead SOT-23 packages.

Revision L (03/2007)

Added 24FC64 Part; Revised Device Selection Table;

Revised Features section; Deleted Rotated TSSOP

Package; Revised Table 1-2; Revised Table 7-1;

Revised Package Information; Replaced package

drawings; Revised Product ID section.

Revision K (08/2005)

Revised Sections 7.1 and 7.4.

Revision J (04/2005)

Added DFN package.

Revision H (12/2003)

Corrections to Section 1.0, Electrical Characteristics.

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