

2019 - 2022 Microchip Technology Inc.

DS20006223B-page 19

MIC33153

14-Lead TDFN 3.0 mm x 3.5 mm Recommended Land Pattern

B

A

0.05 C

0.05 C

0.08

C A B

0.05

C

(DATUM B)

(DATUM A)

C

SEATING

PLANE

NOTE 1

2X

TOP VIEW

VIEW A-A

BOTTOM VIEW

0.10 C

0.08 C

Microchip Technology Drawing C04-1062 Rev A Sheet 1 of 2

2X

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

14-Lead Thin Plastic Dual Flat, No Lead Package (HAA) - 3.5x3 mm Body [TDFN]

With 1.33x1.80 Exposed Pad and Fused Terminals

© 2018 Microchip Technology Inc.

D

E

e

14X b

L

(L1)

(E4)

(E3)

E2

D2

(D3)

K1

K

12

N

1

2

N

A1

(A3)

A

AA

NOTE 1

14X