MIC33153

DS20006223B-page 20

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2019 - 2022 Microchip Technology Inc.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

© 2018 Microchip Technology Inc.

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

1.

2.

3.

Pin 1 visual index feature may vary, but must be located within the hatched area.

Package is saw singulated

Dimensioning and tolerancing per ASME Y14.5M

Number of Terminals

Overall Height

Terminal Width

Overall Width

Terminal Length

Exposed Pad Width

Terminal Thickness

Pitch

Standoff

Units

Dimension Limits

A1

A

b

E2

A3

e

L

E

N

0.50 BSC

0.203 REF

1.75

0.35

0.20

1.05

0.25

0.40

1.80

1.10

3.00 BSC

MILLIMETERS

MIN

NOM

14

1.85

0.45

0.30

1.15

MAX

K-

0.20

-

Terminal-to-Exposed-Pad

Overall Length

Exposed Pad Length

D

D2

1.28

3.50 BSC

1.33

1.38

Exposed Pad Width

E3

0.83 REF

Exposed Pad Length

D3

1.20 REF

Exposed Pad Width

E4

1.42 REF

K1

0.17

0.12

0.22

Package Center to Exposed-Pad

Terminal Length

L1

0.25 REF

Microchip Technology Drawing C04-1062 Rev A Sheet 1 of 2

14-Lead Thin Plastic Dual Flat, No Lead Package (HAA) - 3.5x3 mm Body [TDFN]

With 1.33x1.80 Exposed Pad and Fused Terminals

0.00

0.02

0.05