BLF882_BLF882S#3

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© Ampleon The Netherlands B.V. 2015. All rights reserved.

Product data sheet

Rev. 3 — 1 September 2015

4 of 12

BLF882; BLF882S

UHF power LDMOS transistor

7.2 Test circuit

[1]

American Technical Ceramics type 100B.

[2]

American Technical Ceramics type 800A.

[3]

American Technical Ceramics type 800B.

Printed-Circuit Board (PCB): Taconic RF-35;

thickness copper plating = 35

m, gold plated.

See Table 9 for a list of components.

Fig 1.

Component layout for class-AB production test circuit

Table 9.

List of components

For test circuit see Figure 1.

Component

Description

Value

Remarks

C1

multilayer ceramic chip capacitor

62 pF

[1]

C2

multilayer ceramic chip capacitor

100 nF

C3, C9

multilayer ceramic chip capacitor

56 pF

[1]

C4

multilayer ceramic chip capacitor

12 pF

[2]

C5

multilayer ceramic chip capacitor

11 pF

[2]

C6, C7

multilayer ceramic chip capacitor

24 pF

[2]

C8

electrolytic capacitor

220

F

C10, C11, C12

electrolytic capacitor

750 pF

[1]

C13

multilayer ceramic chip capacitor

16 pF

[3]

C14

multilayer ceramic chip capacitor

18 pF

[3]

C15

multilayer ceramic chip capacitor

5.6 pF

[3]

C16

multilayer ceramic chip capacitor

6.8 pF

[3]

C17

multilayer ceramic chip capacitor

56 pF

[3]

L1, L2, L3

3 turn 1 mm spiral coil

D = 3.0 mm; 120 nH

R1, R2

resistor

10



SMD 1206

R3

resistor

15



SMD 1206

aaa-018618

90 mm

70 mm

C3

C1

R2

C2

R1

C4 C5

C14

C10

C11

C12

C13

C9

C8

R3

C15

C17

C16

C7

C6

L1

L3

L2