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SL2S6002 Datasheet(PDF) 9 Page - NXP Semiconductors

Part # SL2S6002
Description  ICODE DNA
PDF  14 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

SL2S6002 Datasheet(HTML) 9 Page - NXP Semiconductors

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SL2S6002_SDS
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2016. All rights reserved.
Product short data sheet
COMPANY PUBLIC
Rev. 3.0 — 16 June 2016
374730
9 of 14
NXP Semiconductors
SL2S6002
ICODE DNA
7.
Limiting values
[1]
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any conditions other than those described in the operating conditions and electrical
characteristics sections of this specification is not implied.
[2]
This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static
charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maxima.
[3]
The voltage between LA and LB is limited by the on-chip voltage limitation circuitry (corresponding to parameter II).
[4]
For ESD measurement, the IC was mounted in a CDIP8 package.
8.
Characteristics
8.1 Wafer memory characteristics
8.2 Interface characteristics
[1]
Bandwidth limitation (
 7 kHz) according to ISM band regulations.
[2]
Including losses in the resonant capacitor and rectifier.
[3]
Measured with an HP4285A LCR meter at 13.56 MHz and 1.5 V RMS.
[4]
The maximum persistent time strongly depends on the ambient temperature.
Table 6.
Limiting values (Wafer)[1][2]
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
Tstg
storage temperature
55
+125
C
Ptot
total power dissipation
-
125
mW
Tj
junction temperature
40
+85
C
Ii(max)
maximum input current
LA to LB; peak
[3] -
60
mA
II
input current
LA to LB; RMS
-
30
mA
VESD
electrostatic discharge voltage
Human body model
[4] -
2kV
Table 7.
Wafer EEPROM characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
tret
retention time
Tamb  55 C50
-
-
year
Nendu(W)
write endurance
100000
-
-
cycle
Table 8.
Interface characteristics
Typical ratings are not guaranteed. The values listed are at room temperature.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
fi
input frequency
[1] 13.553
13.56
13.567
MHz
Vi(RMS)min
minimum RMS input voltage
operating
read/write
1.1
-
1.3
V
Pi(min)
minimum input power
operating
[2] -40
-
W
Ci
input capacitance
between LA
and LB
[3] 22.3
23.5
24.7
pF
tpersist
persistent time
[4] 2-
-
s



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