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SL2S6002 Datasheet(PDF) 9 Page - NXP Semiconductors |
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SL2S6002 Datasheet(HTML) 9 Page - NXP Semiconductors |
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9 / 14 page ![]() SL2S6002_SDS All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved. Product short data sheet COMPANY PUBLIC Rev. 3.0 — 16 June 2016 374730 9 of 14 NXP Semiconductors SL2S6002 ICODE DNA 7. Limiting values [1] Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any conditions other than those described in the operating conditions and electrical characteristics sections of this specification is not implied. [2] This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maxima. [3] The voltage between LA and LB is limited by the on-chip voltage limitation circuitry (corresponding to parameter II). [4] For ESD measurement, the IC was mounted in a CDIP8 package. 8. Characteristics 8.1 Wafer memory characteristics 8.2 Interface characteristics [1] Bandwidth limitation ( 7 kHz) according to ISM band regulations. [2] Including losses in the resonant capacitor and rectifier. [3] Measured with an HP4285A LCR meter at 13.56 MHz and 1.5 V RMS. [4] The maximum persistent time strongly depends on the ambient temperature. Table 6. Limiting values (Wafer)[1][2] In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Tstg storage temperature 55 +125 C Ptot total power dissipation - 125 mW Tj junction temperature 40 +85 C Ii(max) maximum input current LA to LB; peak [3] - 60 mA II input current LA to LB; RMS - 30 mA VESD electrostatic discharge voltage Human body model [4] - 2kV Table 7. Wafer EEPROM characteristics Symbol Parameter Conditions Min Typ Max Unit tret retention time Tamb 55 C50 - - year Nendu(W) write endurance 100000 - - cycle Table 8. Interface characteristics Typical ratings are not guaranteed. The values listed are at room temperature. Symbol Parameter Conditions Min Typ Max Unit fi input frequency [1] 13.553 13.56 13.567 MHz Vi(RMS)min minimum RMS input voltage operating read/write 1.1 - 1.3 V Pi(min) minimum input power operating [2] -40 - W Ci input capacitance between LA and LB [3] 22.3 23.5 24.7 pF tpersist persistent time [4] 2- - s |
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