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CHA Datasheet(PDF) 3 Page - Vishay Siliconix

Part # CHA
Description  AEC-Q200 Qualified High Frequency 70 GHz Thin Film Chip Resistor
PDF  12 Pages
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Manufacturer  VISHAY [Vishay Siliconix]
Direct Link  http://www.vishay.com
Logo VISHAY - Vishay Siliconix

CHA Datasheet(HTML) 3 Page - Vishay Siliconix

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CH, CHA
www.vishay.com
Vishay Sfernice
Revision: 27-Apr-2022
3
Document Number: 53014
For technical questions, contact: sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PREFERRED MODELS AND VALUES
Vishay Sfernice highly recommend to use the smallest sizes and flip chip version to get the best performances.
Recommended Values:
10R/18R/25R/50R/75R/100R/150R/180R/200R/250R/330R
/500R
Those values are available with a MOQ of 100 pieces.
Other values can be ordered upon request, but higher
MOQ will apply: 1000 pieces for CH02016, 500 pieces for
CH0402, 250 pieces for CH0603.
Recommended termination:
F
Recommended tolerance:
2 %
DESIGN KITS
Design kits are available Ex Stock in CH02016 and CH0402 sizes. There are 20 pieces per recommended value. F termination.
5 % tolerance.
Those kits are packaged in pieces of tape and delivered in ESD bags.
8Operational life
MIL-STD-202 method 108
Condition D steady state
T = 125 °C at rated power
90' on / 30' off / 1000 h
± 2.5 % ± 0.05
Ω
± 1 % ± 0.05
Ω
13
Mechanical shock
MIL-STD-202 method 213
condition C
100 g/6 ms 3.75 m/s
3 shock/direction,
2 directions along 3 axes (18 shocks)
± 0.05 % ± 0.05
Ω
± 0.015 % ± 0.05
Ω
14
Vibration
MIL-STD-202 method 204
5 g for 20 min,
12 cycles each of 3 orientations
Test from 10 Hz to 2000 Hz
± 0.1 % ± 0.05
Ω
± 0.05 % ± 0.05
Ω
15
Resistance to soldering heat
MIL-STD-202 method 210
condition D
Flux used: alpha 611
Solder temp.: 260 °C ± 5 °C
Total immersion during 10 s
± 2.5 % ± 0.05
Ω
± 0.5 % ± 0.05
Ω
17
ESD
AEC-Q200-002
Classification 1C
1000 VDC to 2000 VDC
18
Solderability
J-STD-002
- Preconditioning 4 h dry heat
aging and 235 °C SnPb 5 s
- 215 °C SnPb 5 s
- 260 °C SnAgCu 10 s
Good tinning (
≥ 95 % covered)
No visible damage
20
Flammability
UL 94
Class V-0
No burning
21
Board flex
AEC-Q200-005
± 0.1 % ± 0.05
Ω
± 0.05 % ± 0.05
Ω
24
Flame retardance
AEC-Q200-001
No flame, no explosion,
no temperature higher than 350 °C
TEST PROCEDURES AND REQUIREMENTS
AEC-Q200
CLAUSE
TEST
PROCEDURE
GLOBAL
PERFORMANCES
TYPICAL
PERFORMANCES
(25
Ω TO 250 Ω)



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