| Electronic Components Datasheet Search |
|
LMK04828 Datasheet(PDF) 92 Page - Texas Instruments |
|
|
|
|||||||||||||||||||||||||||||
LMK04828 Datasheet(HTML) 92 Page - Texas Instruments |
|
92 / 102 page ![]() 0.2 mm 1.46 mm 7.2 mm 1.15 mm 92 LMK04828-EP SNAS703 – APRIL 2017 www.ti.com Product Folder Links: LMK04828-EP Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated 12 Layout 12.1 Layout Guidelines 12.1.1 Thermal Management Power consumption of the LMK04828-EP can be high enough to require attention to thermal management. For reliability and performance reasons the die temperature must be limited to a maximum of 125°C. That is, as an estimate, TA (ambient temperature) plus device power consumption times RθJA must not exceed 125°C. The package of the device has an exposed pad that provides the primary heat removal path as well as excellent electrical grounding to a printed-circuit board. To maximize the removal of heat from the package a thermal land pattern including multiple vias to a ground plane must be incorporated on the PCB within the footprint of the package. The exposed pad must be soldered down to ensure adequate heat conduction out of the package. Figure 29. Recommended Land and Via Pattern |
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |