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OPA691 Datasheet(PDF) 29 Page - Texas Instruments |
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OPA691 Datasheet(HTML) 29 Page - Texas Instruments |
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29 / 39 page ![]() 11.2 Layout Example Place bypass capacitor close to power pins Connect the thermal pad to a heat spreading plane; the plane must be at the same potential as VS– Thermal Pad Ground and power plane removed from inner layers. Ground fill on outer layers also removed. Ground and power plane exist on inner layers. 9 4 10 3 11 2 12 1 Bias Control CBYP + IN A Place the feedback resistors, RF and RG, and the source resistors, RS, as close to the device pins as possible to minimize parasitics Considering high power capabilities, use wide supply traces to the bypass capacitors to minimize inductance Place as many vias as possible under the thermal pad and connect them to a heat spreading plane that is at the same potential as VS– - IN A RF RG RS Layout Recommendations have been shown for Channel A only, follow similar precautions for Channel B. Figure 11-1. Layout Recommendations www.ti.com OPA2675 SBOSAA5B – APRIL 2022 – REVISED SEPTEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 29 Product Folder Links: OPA2675 |
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