| Electronic Components Datasheet Search |
|
PCMD3140 Datasheet(PDF) 4 Page - Texas Instruments |
|
|
|
|||||||||||||||||||||||||||||
PCMD3140 Datasheet(HTML) 4 Page - Texas Instruments |
|
4 / 111 page ![]() Table 5-1. Pin Functions (continued) PIN TYPE DESCRIPTION NO. NAME 19 PDMDIN2_GPI2 Analog output/digital input Digital Input 2. MICBIAS output or general-purpose digital input 2 (multipurpose functions such as digital microphones data, MICBIAS, PLL input clock source, and so forth). If used as MICBIAS output, then connect a 1 µF to analog ground (AVSS) 20 VSS Ground supply Device ground internally shorted to thermal pad. Short this package corner pin directly to the board ground plane. See the package drawing at the end of this document for corner pin dimensions. Thermal Pad Thermal Pad (VSS) Ground supply Thermal pad is shorted to the internal device ground. Short the thermal pad directly to the board ground plane. 6 Specifications 6.1 Absolute Maximum Ratings over the operating ambient temperature range (unless otherwise noted)(1) MIN MAX UNIT Supply voltage AVDD to AVSS –0.3 3.9 V AREG to AVSS –0.3 2.0 IOVDD to VSS (thermal pad) –0.3 3.9 Ground voltage differences AVSS to VSS (thermal pad) –0.3 0.3 V Digital input voltage Digital input except PDMDINx_GPIx pins voltage to VSS (thermal pad) –0.3 IOVDD + 0.3 V Digital input PDMDINx_GPIx pins voltage to VSS (thermal pad) –0.3 AVDD + 0.3 Temperature Operating ambient, TA –40 125 °C Junction, TJ –40 150 Storage, Tstg –65 150 (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. PCMD3140-Q1 SBASAH3A – APRIL 2022 – REVISED SEPTEMBER 2022 www.ti.com 4 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: PCMD3140-Q1 |
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |