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LM95235 Datasheet(PDF) 7 Page - National Semiconductor (TI) |
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LM95235 Datasheet(HTML) 7 Page - National Semiconductor (TI) |
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7 / 25 page ![]() Logic Electrical Characteristics (Continued) Notes Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating the device beyond its rated operating conditions. Note 2: Thermal resistance junction-to-ambient when attached to a printed circuit board with 1 oz. foil and no airflow is: θJA for MSOP-8 package = 210˚C/W Note 3: Human body model (HBM) is a charged 100 pF capacitor discharged into a 1.5 k Ω resistor. Machine model (MM), is a charged 200 pF capacitor discharged directly into each pin. Charged Device Model (CDM) simulates a pin slowly acquiring charge (such as from a device sliding down the feeder in an automated assembler) then rapidly being discharged. Note 4: When the input voltage (VI) at any pin exceeds the power supplies (VI < GND or VI > VDD), the current at that pin should be limited to 5 mA. Parasitic components and or ESD protection circuitry are shown in the figures below for the LM95235’s pins. Care should be taken not to forward bias the parasitic diodes on pins 2 and 3. Doing so by more than 50 mV may corrupt the temperature measurements. SNP refers to Snap-back device. Pin # Label Circuit Pin ESD Protection Structure Circuits 1V DD B Circuit A Circuit C Circuit B 2D+ A 3D− A 4 T_CRIT C 5 GND B 6 OS/A0 C 7 SMBDAT C 8 SMBCLK C Note 5: Reflow temperature profiles are different for packages containing lead (Pb) than for those that do not. Note 6: Typicals are at TA = 25˚C and represent most likely parametric norm. Note 7: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level). Note 8: Local temperature accuracy does not include the effects of self-heating. The rise in temperature due to self-heating is the product of the internal power dissipation of the LM95235 and the thermal resistance. See (Note 2) for the thermal resistance to be used in the self-heating calculation. Note 9: The accuracy of the LM95235 is guaranteed when using a typical thermal diode of an Intel processor on a 65 nm process or an MMBT3904 diode-connected transistor, as selected in the Remote Diode Model Select register. See typical performance curve for performance with Intel processor on a 90nm process. Note 10: This specification is provided only to indicate how often temperature data is updated. The LM95235 can be read at any time without regard to conversion state (and will yield last conversion result). Note 11: Quiescent current will not increase substantially when the SMBus is active. Note 12: The output rise time is measured from (VIN(0)max - 0.15V) to (VIN(1)min + 0.15V). Note 13: The output fall time is measured from (VIN(1)min + 0.15V) to (VIN(0)max - 0.15V). Note 14: Holding the SMBDAT and/or SMBCLK lines Low for a time interval greater than tTIMEOUT will reset the LM95235’s SMBus state machine, therefore setting SMBDAT and SMBCLK pins to a high impedance state. www.national.com 7 |
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