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MAX1844 Datasheet(PDF) 19 Page - Maxim Integrated Products

Part # MAX1844
Description  High-Speed Step-Down Controller with Accurate Current Limit for Notebook Computers
PDF  24 Pages
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Manufacturer  MAXIM [Maxim Integrated Products]
Direct Link  https://www.maximintegrated.com/en.html
Logo MAXIM - Maxim Integrated Products

MAX1844 Datasheet(HTML) 19 Page - Maxim Integrated Products

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pation limits often limits how small the MOSFET can be.
Again, the optimum occurs when the switching (AC)
losses equal the conduction (RDS(ON)) losses. High-side
switching losses do not usually become an issue until
the input is greater than approximately 15V.
Switching losses in the high-side MOSFET can become
an insidious heat problem when maximum AC adapter
voltages are applied, due to the squared term in the
CV2f switching loss equation. If the high-side MOSFET
chosen for adequate RDS(ON) at low battery voltages
becomes extraordinarily hot when subjected to
VIN(MAX), reconsider the choice of MOSFET.
Calculating the power dissipation in Q1 due to switching
losses is difficult, since it must allow for difficult-to-quanti-
fy factors that influence the turn-on and turn-off times.
These factors include the internal gate resistance, gate
charge, threshold voltage, source inductance, and PC
board layout characteristics. The following switching loss
calculation provides only a very rough estimate and is no
substitute for breadboard evaluation, preferably including
a sanity check using a thermocouple mounted on Q1.
where CRSS is the reverse transfer capacitance of Q1,
and IGATE is the peak gate-drive source/sink current (1A
typ).
For the low-side MOSFET, Q2, the worst-case power dis-
sipation always occurs at maximum battery voltage:
PD(Q2) = (1 - VOUT / VIN(MAX)) ✕ ILOAD2 ✕ RDS(ON)
The absolute worst case for MOSFET power dissipation
occurs under heavy overloads that are greater than
ILOAD(MAX) but are not quite high enough to exceed the
current limit. To protect against this possibility, you must
“overdesign” the circuit to tolerate ILOAD = ILIMIT(HIGH) +
[(LIR / 2) ✕ ILOAD(MAX)], where ILIMIT(HIGH) is the maxi-
mum valley current allowed by the current-limit circuit,
including threshold tolerance and sense-resistance vari-
ation. If short-circuit protection without overload protec-
tion is adequate, enable undervoltage protection, and
use ILOAD(MAX) to calculate component stresses.
Choose a Schottky diode D1 having a forward voltage
drop low enough to prevent the Q2 MOSFET body diode
from turning on during the dead time. As a general rule,
a diode having a DC current rating equal to 1/3 of the
load current is sufficient. This diode is optional, and if
efficiency isn’t critical it can be removed.
Applications Information
Dropout Performance
The output voltage adjust range for continuous-conduc-
tion operation is restricted by the nonadjustable 500ns
(max) minimum off-time one-shot. For best dropout per-
formance, use the slower (200kHz) on-time settings.
When working with low input voltages, the duty-factor
limit must be calculated using worst-case values for on-
and off-times. Manufacturing tolerances and internal
propagation delays introduce an error to the TON K-
factor. This error is greater at higher frequencies (Table
5). Also, keep in mind that transient response perfor-
mance of buck regulators operated close to dropout is
poor, and bulk output capacitance must often be
added (see the VSAG equation in the Transient
Response section).
The absolute point of dropout is when the inductor cur-
rent ramps down during the minimum off-time (
∆IDOWN)
as much as it ramps up during the on-time (
∆IUP). The
ratio h =
∆IUP/∆IDOWN indicates the circuit’s ability to
slew the inductor current higher in response to
increased load, and must always be greater than 1. As
h approaches 1, the absolute minimum dropout point,
the inductor current will be less able to increase during
each switching cycle, and VSAG will greatly increase
unless additional output capacitance is used.
A reasonable minimum value for h is 1.5, but this may
be adjusted up or down to allow trade-offs between
VSAG, output capacitance, and minimum operating
voltage. For a given value of h, the minimum operating
voltage can be calculated as:
where VDROP1 and VDROP2 are the parasitic voltage
drops in the discharge and charge paths, tOFF(MIN) is
from the Electrical Characteristics table, and K is taken-
from Table 5. The absolute minimum input voltage is cal-
culated with h = 1.
If the calculated VIN(MIN) is greater than the required
minimum input voltage, then operating frequency must
be reduced or output capacitance added to obtain an
acceptable VSAG. If operation near dropout is anticipat-
ed, calculate VSAG to be sure of adequate transient
response.
V
VV
th
K
VV
IN MIN
OUT
DROP
OFF MIN
DROP
DROP
()
()
=
+
()
×


+
1
21
1-
-
PD(Q1 switching)
CV
f
I
I
RSS
IN(MAX)
2
LOAD
GATE
=
×× ×
High-Speed Step-Down Controller with
Accurate Current Limit for Notebook Computers
______________________________________________________________________________________
19



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